Virtual THERMINIC 2020 – Siemens sponsors thermal conference

This year THERMINIC 2020, Europe’s premier electronics thermal event, devoted to thermal effects from ICs…

Digital Testing Symposium

Learn how Testing is Evolving with the Digital Revolution August 26, 2020 8:45 AM –…

Can’t see the Wood for the Trees …

Dealing with complex simulation data can sometimes be challenge, especially if you are dealing with…

So what is FOWLP and its applications?

Well, simply put, it is a relatively new high-density advanced packaging technology: Fan-Out Wafer-Level Packaging….

Eleven top tips for energy efficient data center design and operation

There is a growing awareness of the carbon footprint of data centers. The energy costs…

Sound Camera

What’s that noise? Simcenter Sound Camera 2019.1

“That noise? Yes, I hear it and I can measure it, but where is it…

Simcenter™ FLOEFD™ 2019.4: What’s New?

Simcenter™ FLOEFD™ 2019.4 was released beginning of January 2020. The new version provides a range…

Simcenter™ FLOEFD™ 2019.3: What’s New?

Simcenter FLOEFD 2019.3 was released in November 2019. The new version provides a range of…

Engineer INNOVATION Issue 4

Engineer INNOVATION Issue 4!

Violins, pool and marathon running. Keen on a game of pool?  Enjoy listening to a…