The new VX.2.14 release of Xpedition IC Packaging includes improvements and enhancements to both Xpedition Substrate Integrator and Xpedition Package…
We have witnessed and learned about the industry’s significant shift in semiconductors. The traditional approach of transistor scaling, once universally…
Advancements in IC packaging manufacturing, combined with the exploding costs of designing monolithic ICs on today’s advanced process nodes, have…
The key analysis needs of high-performance computing semiconductor package design Today, power requirements are continually increasing as you bring more…
Designs are just getting bigger and more complex Yes, an obvious aspect is increasing design complexity. Packages are now a…
The connectivity management complexity of package assemblies where multiple chiplets/ASICs and memory are heterogeneously integrated, introduces a great deal of…
The Xpedition high density advanced packaging solution it is made up of two core products, Xpedition Substrate Integrator (xSI) which…
If you’re designing a high-performance processor-based package, it’s common for the semiconductor package design to contain multiple logic chips that…
People have been designing “modules” or system-in-packages (SiP) for a number of years; but in the last 3-5 years, I…
