Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

Let AI help with macro placement during place and route

January 03, 2024

Aprisa’s AI-driven Auto Macro Placement (AMP) creates a high-quality floorplan in a fraction of the time needed for manual macro placement.

Calibre IC Design & Manufacturing

Streamlining IC design verification with Calibre nmLVS Recon

January 03, 2024

By Kesmat Shahin As integrated circuits (ICs) become more complex, meeting tapeout schedules has become increasingly challenging. Statistics from industry...

By Calibre IC Design & Manufacturing

Semiconductor Packaging

Parasitic extraction technologies: Advanced node and 3D-IC design

January 02, 2024

Advanced nodes and 3D-IC packages require new and enhanced parasitic extraction processes that can resolve a variety of complex parasitic issues in these designs.

By John McMillan

Electronic Systems Design

Thermal analysis: a crucial part of any PCB design flow

December 21, 2023

Thermal analysis stands out as a pivotal tool for ensuring the reliability, performance, and longevity of electronic systems. Often overshadowed...

Semiconductor Packaging

Impacts of 3D IC on the future

December 20, 2023

3D IC technology development started many years ago well before the slowing down of Moore’s law benefits became a topic...

By John McMillan

Electronic Systems Design

Adapt to Design - Design for manufacturing

December 20, 2023

Design for manufacturing, or DFM, is a crucial aspect of electronics manufacturing best practices. It emphasizes that each printed circuit...

By Paul Carpine

Electronic Systems Design

What’s New in Valor NPI 2311

December 19, 2023

Each new Valor NPI release brings exciting features and improvements, and Valor NPI version 2311 is no different. One of the most prominent recent changes for release 2311 is the 3D board viewer. This allows users to toggle between the typical 2-D board view, and a 3-D board view. While less visually prominent, the addition of high-risk component detection is no less impactful among the overall improvements. The Valor Parts Library now associates individual components with a manufacturing risk value. This allows you to consider at-a-glance relative yield values based on component choices. Valor NPI version 2311 also facilitates the placement of XD components in a zigzag array.

Tessent Solutions

Three ways to slash AI chip TTM with advanced DFT and silicon bring-up

December 19, 2023

Advanced EDA technology eases AI chip development.

By Lee Harrison

Semiconductor Packaging

System-level, post-layout electrical analysis for high-density advanced packaging (HDAP)

December 18, 2023

HDAP designs like FOWLP need post-layout simulation (analog) and post-layout STA (digital) flows to augment basic physical verification DRC and LVS.

By John McMillan