Impacts of 3D IC on the future

3D IC technology development started many years ago well before the slowing down of Moore’s law benefits became a topic…

System-level, post-layout electrical analysis for high-density advanced packaging (HDAP)

HDAP designs like FOWLP need post-layout simulation (analog) and post-layout STA (digital) flows to augment basic physical verification DRC and LVS.

Crossing the chasm: Bringing SoC and package verification together

3D IC package designers need assembly-level LVS for HDAP verification.

Package designers need assembly-level LVS for HDAP verification

While advanced integrated circuit (IC) packaging is a fast-growing market, comprehensive package verification still has a ways to go. Unique…

Image of chiplets with text onscreen saying HBM

High Bandwidth Memory (HBM): Unleashing the power of next-gen memory technology

In the ever-evolving realm of semiconductor technology, one innovation stands out above the rest: High Bandwidth Memory (HBM). Offering unparalleled…

What's new in Xpedition IC Packaging

What’s new in Xpedition IC Packaging VX.2.14

The new VX.2.14 release of Xpedition IC Packaging includes improvements and enhancements to both Xpedition Substrate Integrator and Xpedition Package…

system technology co-optimization

Shifting left with system technology co-optimization for IC packaging

We have witnessed and learned about the industry’s significant shift in semiconductors. The traditional approach of transistor scaling, once universally…

Image of an IC package design with text that says A workflow methodology for homogeneous disaggregation using hierarchical device planning

A workflow methodology for homogeneous disaggregation using hierarchical device planning

Advancements in IC packaging manufacturing, combined with the exploding costs of designing monolithic ICs on today’s advanced process nodes, have…

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A “big rock” approach to DC drop analysis in IC package design

The key analysis needs of high-performance computing semiconductor package design Today, power requirements are continually increasing as you bring more…