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Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

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Calibre IC Design & Manufacturing

The path of least resistance…leads to more reliable designs

April 06, 2022
By Derong Yan Meeting tapeout schedules and performance requirements are equally critical conditions for IC design success. Now engineers can...
By Calibre IC Design & Manufacturing
2 MIN READ

Custom IC

The Importance of RF Harmonic Balance Analyses

April 05, 2022
Radio frequencies are all around us and are busy at work within the modern day electronic devices and systems. Those...
By Pradeep Thiagarajan
2 MIN READ

Calibre IC Design & Manufacturing

Mastering RF design challenges: The role of capacitors and context-aware PEX Tools

April 04, 2022
By Claudia Relyea and Sandeep Koranne  Updated January 17, 2025 The increasing complexity of modern RF circuits demands precise modeling...
By Calibre IC Design & Manufacturing
5 MIN READ

Tessent Solutions

Siemens EDA talks cybersecurity at IP-SoC Silicon Valley

April 01, 2022
The Tessent group participated in the “unique event fully dedicated to IP and IP-based electronic systems,” D&R IP-SoC Silicon Valley...
By Tessent Solutions
< 1 MIN READ

Calibre IC Design & Manufacturing

Accelerating IC design time to market with Calibre in the cloud

March 31, 2022
By Michael White When you’re flying, it’s fun to look out the window and see clouds from “the other side.”...
By Calibre IC Design & Manufacturing
2 MIN READ

Tessent Solutions

Webinar: Memory test using a shared bus Interface

March 31, 2022
The explosive growth in the use of memory content on SoCs calls for a new solution to effectively access the...
By Tessent Solutions
< 1 MIN READ

Electronic Systems Design

A customer survey confirms: Early DFM is more important than ever

March 31, 2022
It’s a given in manufacturing—the earlier you catch an error, the less it will cost to remedy. In the electronics...
By Shirley Segev
4 MIN READ

Custom IC

Accelerating the next wave of semiconductor innovation – AMS verification on the cloud 

March 30, 2022
Are we over the chip shortage? The latest projections show that the chip shortage will not ease significantly until later...
By Nebabie Kebebew
< 1 MIN READ

Electronic Systems Design

What’s New in Xpedition IC Packaging-VX.2.11

March 29, 2022
Xpedition IC Packaging VX.2.11 delivers capabilities targeting heterogenous integration and the prototyping, planning, design and verification of next-generation 2.5/3D package...
By John McMillan
< 1 MIN READ

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