Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

Semiconductor Packaging

The beginner’s guide to 3D IC

Why 3D IC technology matters As consumer electronic devices grow increasingly connected, intelligent, and advanced, designers need new methodologies like...

By Heather George

Calibre IC Design & Manufacturing

Interactive symmetry checking for analog/custom ICs: Faster, easier, more accurate

By Sara Khalaf While the reliability and performance of multiple types of designs such as analog, MEMs, and image sensors...

By Calibre IC Design & Manufacturing

Electronic Systems Design

Choosing the right laminate for your PCB design

A balanced approach to material selection involves understanding and considering more than just electrical parameters. In general, with dielectric materials, every parameter that improves performance comes at a marginal increase in cost. Because of this, ensuring that you don’t overdesign within your materials is quite important.

By Patrick Hope

Semiconductor Packaging

Semiconductor package design market trends: 2023 forecast from Siemens EDA

Semiconductor package design industry in 2023 expects to see accelerated growth of heterogeneous integration resulting emergence and adoption of new technology.

By Keith Felton

Arm finds success with Siemens Aprisa place-and-route

Arm is a market leader in semiconductor IP, including interconnect technologies that serve as the backbone of many system-on-chips (SoCs)....

Tessent Solutions

Chip data joins the party with Tessent Host Services software

Siemens’ Tessent Embedded Analytics IP and software, Host Services software opens the lines of communication with your chip and brings SLS one step closer to reality.

By Tessent Solutions

Calibre IC Design & Manufacturing

Optimizing design implementation with Calibre LEF/DEF technology

By James Paris and Armen Asatryan Ever hear the saying “When all you have is a hammer, everything looks like...

By Calibre IC Design & Manufacturing

Calibre IC Design & Manufacturing

Curves ahead for IC manufacturing

By John Sturtevant It turns out that the ideal mask pattern to print such a circle is in fact a...

By Calibre IC Design & Manufacturing

Electronic Systems Design

What's new in Valor NPI v11.5

Valor NPI 11.5 continues to introduce new and existing capabilities in MRA-Revolution, with a more complete Classification set which includes design preparations and analysis use of copper reference layers. Comparing an ODB++ to fabricator changes becomes easy and precise with the new CAM Compare flow and the first connection to stackup setup is established with Z-Planner integration.