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Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

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Semiconductor Packaging

The Five Keys to Next-Generation IC Packaging Design: Part 1

September 07, 2022
Part 1: An advanced IC packaging design and verification solution For many applications, next generation IC packaging is the best...
By Keith Felton
2 MIN READ

Custom IC

Making those bits go analog

September 06, 2022
It has been a very good year of partnership with Analog Bits, one of our key partners, and I wanted...
By Pradeep Thiagarajan
2 MIN READ

Electronic Systems Design

What is the PCB Design Process?

September 06, 2022
The PCB design process can be different depending on your company, but the fundamental aspects are all the same –...
By Don Kost
3 MIN READ

Electronic Systems Design

Can you accelerate the selection of alternate components?

September 02, 2022
This blog was written by Chad Jackson, Chief Analyst & CEO at Lifecycle Insights, and comments have been provided throughout...
By Chad Jackson
7 MIN READ

Electronic Systems Design

The engineer and the electronic component sourcing process – how to streamline that today and streamline BOM verification

August 31, 2022
This blog was written by Chad Jackson, Chief Analyst & CEO at Lifecycle Insights, and comments have been provided throughout...
By Chad Jackson
6 MIN READ

Electronic Systems Design

Check out the new PCB track at IESF 2022

August 30, 2022
IESF Automotive is organized by Siemens Digital Industries Software and has been a must-attend event for automotive E/E design professionals...
By Julie Weber
2 MIN READ

Semiconductor Packaging

3D IC verification requires a golden netlist that allows exceptions

August 29, 2022
With current 3D IC packaging technologies, since the system-level netlist (the 3D IC design intent) drives system-level LVS verification, designers...
By Tarek Ramadan
< 1 MIN READ

Electronic Systems Design

Bringing resilience at the point of design

August 25, 2022
This blog was written by Chad Jackson, Chief Analyst & CEO at Lifecycle Insights, and comments have been provided throughout...
By Chad Jackson
7 MIN READ

Semiconductor Packaging

Megatrends of advanced IC packaging solutions 

August 25, 2022
Over last 2-3 years, everyone has been talking about Moore’s “Law” becoming invalid. Even if it does, we will continue...
By Keith Felton
3 MIN READ

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