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Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

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Semiconductor Packaging

Thermal management in 3D IC: Challenges, modeling and design strategies 

January 26, 2026
You are likely here because thermal issues have become the primary constraint shaping your 3D IC design decisions. As 3D integration pushes more performance into smaller footprints, thermal...
By Tova Levy
5 MIN READ

Electronic Systems Design

Accelerating the search through millions of “what if” scenarios

January 26, 2026
HyperLynx Design Space Exploration can help you optimize your design’s performance by exploring a very large design space in a fraction of the time required with traditional methods.
By Sajeda Tamimi
3 MIN READ

Electronic Systems Design

ASTER Technologies strengthens Siemens digital thread for optimized PCB manufacturability

January 22, 2026
Siemens EDA is pleased to announce its acquisition of ASTER Technologies, a trusted name within the PCB design industry with more than...
By Patrick Hope
4 MIN READ

Calibre IC Design & Manufacturing

ESD verification in 3D ICs: Navigating unseen risks and new realities

January 21, 2026
Discover best practices for automated 3D IC ESD verification using Calibre 3DPERC. Learn how to address the unique challenges of ESD protection in advanced 3D IC designs and ensure system-level reliability.
By Calibre IC Design & Manufacturing
5 MIN READ

Semiconductor Packaging

Ensure 3D IC Multiphysics Reliability for AI Systems at Scale

January 18, 2026
Every new generation of AI systems pushes SoC design teams closer to the end of Moore’s Law. The core question...
By Tova Levy
6 MIN READ

Semiconductor Packaging

What Lies Ahead for System-Technology Co-Optimization (STCO) in 2026

January 15, 2026
The race to build ever more powerful and energy-efficient AI chips has been underway for years, but 2026 is shaping...
By Per Viklund
5 MIN READ

Semiconductor Packaging

AI is reshaping the 3D IC design ecosystem: Key trends to watch in 2026

January 15, 2026
Headlines on how the global AI race leads to the shortages of GPUs are in no short supply. Behind those...
By Sudarshan Deo
4 MIN READ

Electronic Systems Design

Design smarter, not harder: Evolving design reuse methodologies in EDA

January 14, 2026
In this episode of the Printed Circuit Podcast, host Steph Chavez explores the growing impact of design reuse in electronic design automation (EDA),...
By Arlina Yang
3 MIN READ

Electronic Systems Design

From fragmented to connected: Rethinking the electronics design journey

January 13, 2026
How digital design threads connect concept, design, and manufacturing to reduce risk, rework, and time to market.
By David Haboud
8 MIN READ

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