Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

Electronic Systems Design

Unleash the power of DDR5 & LPDDR5 parallel simulations

With the release of HyperLynx 2604, Siemens EDA is empowering engineers to do just that, thanks to the new DDRx Batch Wizard Parallelization Support.

By Sajeda Tamimi

Semiconductor Packaging

Streamlining 3D IC design interface performance

If you are planning to design a high-performance multi-chiplet heterogeneously integrated package, then you know that to achieve design performance, the integration between the logic chiplets is key.

By Keith Felton

Electronic Systems Design

What's new in Z-planner Enterprise 2604

This release focuses on delivering greater accuracy, improved efficiency, and expanded capabilities for engineers tackling today’s complex electronic designs. Let’s...

By Patrick Hope

EDA Support Blogs

How to run your SSN datapath at double your I/O data rate

Imagine your chip’s internal SSN bus is a super-fast highway, capable of handling data at 400 MHz. However, the external...

Electronic Systems Design

What’s new in BluePrint-PCB 2604

The recent addition of BluePrint-PCB to the Siemens portfolio represents a significant evolution for our customers, as it provides an advanced documentation tool for the PCB development lifecycle, from design through manufacturing release.

By Patrick Hope

Electronic Systems Design

Accelerate PCB design productivity with AI and intelligent automation: Design reuse, data continuity and connected workflows

Siemens Xpedition combines intelligent automation, design reuse, and connected data continuity across the PCB development flow.

By David Haboud

Calibre IC Design & Manufacturing

The Calibre 3D IC solution: Mastering the complexities of advanced 3D IC chip design

Optimize 3D IC chip design from concept to sign-off with Calibre 3D IC solutions. Achieve accurate electro-thermo-mechanical co-simulation, prevent costly errors, and accelerate time-to-market.

By Calibre IC Design & Manufacturing

Semiconductor Packaging

Streamlining power integrity analysis for 3D IC designs

The rules of semiconductor scaling have changed. With traditional transistor scaling slowing, advanced packaging has emerged as the primary driver...

By Sudarshan Deo, Muhammad Hassan

Microchip’s journey to accelerated verification with Solido Additive Learning

Microchip leverages Solido Additive Learning's AI-driven approach to accelerate iterative variation-aware verification by 3x to 20x, reducing re-verification cycles from weeks to hours.

By Jayne Alexander