Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

Hardware Assisted Verification

FPGA-based prototyping – to build, or to buy, that is the question!

Almost as long as FPGAs have been around, they have been used to prototype ASICs, SoCs, and IPs. While initially,...

By Juergen Jaeger

Design with Calibre

Siemens shines at the 2025 SPIE Advanced Lithography + Patterning symposium

The SPIE Advanced Lithography + Pattering symposiums were held 23-27 February this year with the usual enthusiastic and sizable attendance...

By Design With Calibre

Electronic Systems Design

Blind and buried vias: An HDI technology

One of the key innovations within HDI PCB design is the use of blind and buried vias, which enhance routing capabilities by freeing up additional routing resources, increasing the amount of routing channels while requiring fewer signal layers, and optimizing board space.

By Stephen V. Chavez

EDA Support Blogs

3D-IC design using Calibre 3DSTACK

By Minjung Han (minjung.han@siemens.com), Calibre Support Application Engineer 3D-IC technology is gaining attention as an alternative to complement Moore’s Law,...

EDA Support Blogs

Calibre 3DSTACK을 활용한 3D-IC 설계

By 한민정 과장 (minjung.han@siemens.com), Calibre Support Application Engineer 3D-IC 기술은 무어의 법칙이 물리적 한계에 가까워지면서 이를 보완하는 대안으로 주목받고 있습니다....

Design with Calibre

Solving IR drop and layout bottlenecks: How Calibre DesignEnhancer streamlines IC design

By Jeff Wilson As an IC designer, you know that achieving an optimal layout is about more than just meeting...

By Design With Calibre

Electronic Systems Design

Optimizing FPGA/PCB co-design: Best practices and industry insights

Previously on episode 20 of the Printed Circuit Podcast, host Steph Chavez explored the intricacies of FPGA (field-programmable gate array)...

Semiconductor Packaging

Accelerate IC design innovation with Siemens: Navigating the future of 3D IC design to manufacturing

In the rapidly evolving semiconductor industry, the drive towards miniaturization and the integration of complex functions through advanced packaging and...

By John McMillan

The Crucial Role of Full-Spectrum Transient Noise Analysis for Silicon Success

As chips continue to push the boundaries of performance, ensuring first time silicon success has never been more critical. For...

By Scott Guyton