Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

Semiconductor Packaging

What’s New in Innovator3D IC solution suite release 2510

October 27, 2025

Innovator3D IC solution suite release 2510 marks a groundbreaking first release of the comprehensive Innovator3D IC solution suite.

By Keith Felton

Electronic Systems Design

Rigid-flex PCB design with Xpedition Standard

October 21, 2025

Xpedition Standard brings powerful capabilities that help you confidently navigate rigid-flex PCB design.

By David Haboud

Hardware Assisted Verification

Beyond the Lab Mobile FPGA Prototyping Transforms Automotive Testing

October 17, 2025

“We spend months validating Advanced Driver Assistance Systems (ADAS) features in the lab, only to discover new issues during road...

By Zaid Rodriguez

Calibre IC Design & Manufacturing

From translator to powerhouse: Calibre V2LVS second generation redefines LVS verification

October 16, 2025

Explore second-generation Calibre Verilog-to-LVS: up to 4X faster runtimes, 92% less memory use, smarter debugging and robust SoC verification for advanced digital designs

By Calibre IC Design & Manufacturing

Electronic Systems Design

Mastering the bend: Essential tips & tricks for rigid-flex PCB design

October 15, 2025

Getting rigid-flex PCB design right requires a little know-how. To help you navigate the exciting world of bendable electronics, I've put together some essential tips and tricks.

By Stephen V. Chavez

Cre8Ventures (Siemens EDA)

Methods2Business Joins SiemensCre8Ventures Sovereign Digital Twin Marketplace

October 10, 2025

Siemens Cre8Ventures is delighted to welcome Methods2Business to our Sovereign Digital Twin Marketplace and our first-of-a-kind dual-use sovereign dual use...

By Carson Bradbury

Electronic Systems Design

Cutting your losses - loss planning and you

October 09, 2025

Loss planning - What is the best laminate for a loss budget of x dB for y inches? I was thinking in terms of Panasonic Megaton (sic) 6 or something like it.

Semiconductor Packaging

From 2.5D to true 3D IC: What's driving the next wave of integration.

October 08, 2025

With 3D IC integration blurring the lines between chip and package, is your team’s mindset truly system-centric, or are traditional...

By John McMillan

Driving the Future of Custom IC Design with AI: Highlights from Siemens EDA Forum Taiwan

October 07, 2025

The Siemens EDA Forum in Taiwan brought together a packed audience and an impressive showcase of booths from across the...

By siddharth ravikumar