Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

Electronic Systems Design

AI in the engineer’s seat: Speeding up PCB design without giving up control

February 18, 2026

In this episode of the Printed Circuit Podcast, host Steph Chavez sits down with Antonio Becerra Esteban, Head of Customer...

Calibre IC Design & Manufacturing

How to use Calibre parasitic extraction tools: a step-by-step guide

February 17, 2026

A step by step guide designed to help users master the Calibre parasitic extraction tools

By Calibre IC Design & Manufacturing

Cre8Ventures (Siemens EDA)

HERADO Joins the Siemens Cre8Ventures Digital Twin Marketplace

February 17, 2026

Advancing Sovereign Real-Time Radiation Intelligence for Dual-Use Autonomy Siemens Cre8Ventures is pleased to announce that HERADO has joined our sovereign...

By Carson Bradbury

Electronic Systems Design

Unmanufacturable via structures you may not know in a design

February 17, 2026

Understanding the characteristics of manufacturable via structures is important for successful PCB design and fabrication. By following solid DFM guidelines and consulting your fabricators, designers can prevent unmanufacturable boards, reduce costs, and accelerate the development of reliable electronic products.

Electronic Systems Design

Six challenges that make flex circuits more difficult to manufacture

February 16, 2026

Flex circuits present manufacturing challenges and let's look at six to avoid when designing these regions.

Electronic Systems Design

Why UHDI is pushing the limits of what's possible

February 11, 2026

In this episode of the Printed Circuit Podcast, host Steph Chavez sat down with Anaya Vardya, CEO of American Standard Circuits...

Semiconductor Packaging

Five Key Trends of Co-Packaged Optics (CPO) in 2026

February 05, 2026

For years, data-center performance scaled by following a familiar playbook: faster GPUs, higher SerDes rates, and increasingly aggressive board designs....

By Tony Mastroianni

Semiconductor Packaging

Six Key Trends Redefining 3D IC Packaging in the AI Era

February 05, 2026

Some say we are officially in the Post-Moore’s Law world.  Moore himself closed his seminal paper by mentioning the “day...

By Pratyush Kamal

Semiconductor Packaging

Verifying your 2.5/3D IC device assembly level netlist

February 04, 2026

In this blog we will introduce a new way to verify your 2.5/3D IC device assembly level netlist using formal verification that can exhaustively verify all interconnections between the chiplet blocks.

By Keith Felton