Electromigration and IC Reliability Risk

Electromigration and IC Reliability Risk

By Dina Medhat, Mentor Graphics Gradual damage from electromigration can affect product performance and reduce product lifetimes. Reliability analysis ensures…

You’re Not Alone

You’re Not Alone

By Srinivas Velivala, Mentor Graphics Calibre How-To videos replace your roadblocks with fast solutions for tricky verification problems

Resetting Expectations on Multi-Patterning Decomposition and Checking

Resetting Expectations on Multi-Patterning Decomposition and Checking

By David Abercrombie, Mentor Graphics Some common misconceptions about multi-patterning processes and just how they work.

LEF/DEF IO Ring Check Automation

LEF/DEF IO Ring Check Automation

By Matthew Hogan, Mentor Graphics Designing today’s complex system-on-chips (SoCs) requires careful consideration when planning input/output (IO) pad rings…  

Correct by Construction and Other Myths

Correct by Construction and Other Myths

By Joseph Davis, Mentor Graphics Is “correct by construction” a myth?

Why Do We Need Assembly Design Kits for Packages?

Why Do We Need Assembly Design Kits for Packages?

By John Ferguson and Tarek Ramadan, Mentor Graphics Why do we need assembly design kits for IC packages?

Reported Death of Moore’s Law Premature?

Reported Death of Moore’s Law Premature?

By Michael White, Mentor Graphics Is Moore’s Law dying? A look at the latest process node activity and technology

Together At Last – Combining Netlist and Layout Data for Power-Aware Verification

Together At Last – Combining Netlist and Layout Data for Power-Aware Verification

By Beth Martin, with Sridhar Srinivasan, Yi-Ting Lee, and Frank Feng, Mentor Graphics Reliability checks on multiple-power-domain and mixed-signal designs…

MEMS Technology and Manufacturing on the Microscale

MEMS Technology and Manufacturing on the Microscale

By Carey Robertson and Khaled AbouZeid, Mentor Graphics Designers incorporating MEMS devices into high-volume CMOS ICs need new processes, data,…