AUA announces extension of collaboration with Siemens for advanced research and academic enhancement

Back in 2012, the American University of Armenia (AUA) initiated a collaborative relationship with electronic design automation (EDA) leader Mentor…

Google, AMD, and Siemens EDA walk into a cloud…

By Michael White At DAC this past July, I had the opportunity to sit down with Phil Steinke from AMD…

What’s an ESD design window, and why do I care?

By Derong Yan As we move to advanced semiconductor process nodes, electrostatic discharge (ESD) issues have become more critical in…

Can you spot the difference?

By James Paris We’ve all played those “Spot the Difference” games where you look at two similar images and try…

Interactive symmetry checking for analog/custom ICs: Faster, easier, more accurate

By Sara Khalaf While the reliability and performance of multiple types of designs such as analog, MEMs, and image sensors…

Ease on down the road…why “ease of use” is the next big thing in EDA, and how we get there

Ease of use is an important issue when enhancing product functionality and introducing new technology. Calibre Design Systems considers ease…

Is there a quick and easy way to calculate P2P resistance or current density between any two coordinates in my IC design layout?

By Li Li Why, yes, there is! As you know, Calibre® PERC™ logic-driven layout (LDL) current density (CD) and point-to-point…

Want to know what went on at the TSMC OIP Forum this year? Here’s the inside scoop…

TSMC customers and partners always look forward to the annual TSMC Open Innovation Platform® (OIP) Forums. Here, they get the…

Fix first, finish faster!

By James Paris A few years ago, I came across some plans to build a simple bookshelf that would fit…