By Michael White, Mentor Graphics Will fan-out wafer-level packaging be the impetus that pushes 3D-IC into mainstream acceptance?
By David Abercrombie, Mentor Graphics Triple and quadruple patterning can baffle even the most experienced designers. David Abercrombie has some…
By David Abercrombie, Mentor Graphics Some common misconceptions about multi-patterning processes and just how they work.
By Ruping Cao, Mentor Graphics Verifying silicon photonics designs requires new techniques, like equation-based DRC
By Michael White, Mentor Graphics Is Moore’s Law dying? A look at the latest process node activity and technology
David Abercrombie continues his expert advice to P&R and chip finishing engineers on understanding and debugging multi-patterning errors accurately and…
By David Abercrombie, Mentor Graphics Multi-patterning errors in P&R layouts can be intricate, and their solutions may not be obvious
By Michael White, Mentor Graphics Much of the Internet of Things (IoT) functionality we crave is more cost-effective when implemented…
By John Ferguson and Jonathan Muirhead, Mentor Graphics Ensuring a known level of quality