In the first podcast about 3D IC heterogeneous integration, we talked about the disaggregation of once monolithic implementation architectures into…
If you’re involved in semiconductor package design using routable substrates — that is, as opposed to leadframe based — then…
Why 3D IC technology matters As consumer electronic devices grow increasingly connected, intelligent, and advanced, designers need new methodologies like…
Semiconductor package design industry in 2023 expects to see accelerated growth of heterogeneous integration resulting emergence and adoption of new technology.
