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Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

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HLS Design & Verification Blog

SemiWiki: Mentor Showcases Digital Twin Demo

March 06, 2019
Excerpt from article: “Mentor Showcases Digital Twin Demo“ Siemens EDA put on a very interesting tutorial at DVCon this year. Commonly...
By nileshthiagarajan
< 1 MIN READ

Electronic Systems Design

"After the Webinar" Podcast: Reduce Design Time Using Routing Automation

March 05, 2019
February 20th’s Routing Automation webinar was an outstanding success! Can you use “sketch routing” for every net? What is the...
By Brent Klingforth
2 MIN READ

HLS Design & Verification Blog

Tech Design Forum: Catapult HLS Integrates eFPGA IP for Faster Development

March 02, 2019
Excerpt from article: “Catapult HLS Integrates eFPGA IP for Faster Development“ Siemens EDA is looking to extend the configurability options...
By nileshthiagarajan
< 1 MIN READ

Calibre IC Design & Manufacturing

Context-aware verification checks enhance checking and debugging capabilities

February 15, 2019
By Sherif Hany – Mentor, A Siemens Business Automated context-aware verification helps designers ensure the performance and reliability of complex...
By Calibre IC Design & Manufacturing
2 MIN READ

Electronic Systems Design

Don't Be Left In The Dark, Use Readily Available Technology To Design Faster!

February 13, 2019
As an engineer, you have to anticipate unforeseen roadblocks and, regardless, find ways to meet deadlines. It’s been documented by...
By Brent Klingforth
< 1 MIN READ

Calibre IC Design & Manufacturing

Silicon photonics design and verification joining the mainstream

February 05, 2019
By John Ferguson – Mentor, A Siemens Business Silicon photonics offers up the promise of blazing fast data transmission and...
By Calibre IC Design & Manufacturing
2 MIN READ

Tessent Solutions

Meet aggressive time-to-market for AI chips by slashing DFT time

February 01, 2019
Semiconductor companies are racing to develop AI-specific chips to meet the rapidly growing compute requirements for artificial intelligence (AI) systems....
By Tessent Solutions
3 MIN READ

Electronic Systems Design

After the Webinar Podcast - MCAD Collaboration and Co-design

January 30, 2019
Last weeks MCAD Collaboration and Co-design Webinar was a hit! What MCAD tools are supported?  – Where do the 3D...
By John McMillan
2 MIN READ

Calibre IC Design & Manufacturing

Lane ends—full-chip merge ahead

January 21, 2019
By James Paris – Mentor, A Siemens Business Fast layout merging during continuous build flows makes it easier to solve...
By Calibre IC Design & Manufacturing
2 MIN READ

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