Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

Electronic Systems Design

Remote collaboration in electronic systems design: How teams are building the future… from anywhere

Remote collaboration in ESD is no longer a stopgap nor isn’t just feasible. It’s a strategic shift. It’s a smarter, scalable way to build the future.

By Stephen V. Chavez

Semiconductor Packaging

Why Traditional PCB Methods Fall Short in 3D IC Design

In this episode of the Siemens 3D IC Podcast Series,we delve into the world of FOWLP (Fan-out wafer-level packaging) with...

By John McMillan

Meet the Solido Custom IC Team at DAC 2025

The Solido Custom IC (CIC) team is gearing up for an exciting presence at DAC 2025, where visitors will discover our innovative AI solutions that are transforming the custom IC landscape.

By Emma-Jane Crozier

Electronic Systems Design

Cutting through the noise: Modern strategies for RF PCB design

In season three of the Printed Circuit Podcast, host Steph Chavez sat down with Per Viklund, Director of IC Packaging...

Blueprint for Achieving Excellence in EDA using AI: Industry Experts Weigh In

This engaging Siemens EDA panel on AI implementation highlighted several key points: AI will enhance human expertise in EDA; while rich EDA data is crucial, it also poses challenges; robust compute infrastructure is essential for AI-driven EDA systems; and the adoption of AI should be swift yet stable

By Niranjan Sitapure, PhD.

Solido Custom IC Innovation at Intel Foundry Direct Connect 2025

The Solido Custom IC team, alongside colleagues from across Siemens EDA, joined ecosystem partners at Intel Foundry Direct Connect 2025 this April in San Jose.

By siddharth ravikumar

Design with Calibre

Enhancing EUV lithography resolution at high numerical aperture

By Ethan Maguire As the semiconductor industry continues to push the boundaries of feature size and density, the need for...

By Design With Calibre

Electronic Systems Design

Bending the rules: How to design smarter with rigid-flex PCBs

In a season three of the Printed Circuit Podcast, host Steph Chavez welcomed industry expert Tara Dunn, Director of Training...

Heading to DAC 2025 with Thine: Advanced Verification Solutions for ICs to Ensure High Quality Amid PVT Variations

At the center of modern communication systems lies a critical component: the phase interpolator (PI). This relatively tiny component plays...