Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

EDA Support Blogs

Boundary Scan Evolved: Enabling Hierarchical Designs with Tessent EBSCAN

December 29, 2025

Boundary scan is an integral part of electronic circuit design, be it system level, PCB level, chip level or physical...

How NXP Achieved Robust Verification and Portfolio Re-characterization of Liberty IP with Solido Characterization Suite

December 23, 2025

At the Design Automation Conference (DAC), Siemens EDA and NXP collaborated to showcase innovative methodologies that directly address two of the most critical challenges in library characterization: accelerating Liberty (.lib) characterization and verification. Together, we presented solutions that redefine traditional approaches, creating efficient and reliable workflows that advance NXP’s design process.

By Ray Valencia

Accelerating TRNG Verification: Microsoft-Siemens EDA Breakthrough Simulation Methodology at DAC

December 23, 2025

From 1.5-year simulation bottlenecks to verification in days, Microsoft and Siemens EDA's collaboration eliminates one of the biggest roadblocks in hardware security verification.

By Emma-Jane Crozier

Cre8Ventures (Siemens EDA)

IMCHIP Joins the Siemens Cre8Ventures Digital Twin Marketplace

December 23, 2025

Advancing Sovereign, Energy-Efficient AI for Drones Siemens Cre8Ventures is pleased to announce that IMCHIP has joined the Siemens Cre8Ventures Digital...

By Carson Bradbury

Electronic Systems Design

When design meets manufacturing: Why the digital thread and digital twin are leadership imperatives

December 22, 2025

When design and manufacturing operate without a cohesive digital twin, the consequences ripple across the enterprise.

By Stephen V. Chavez

Tessent Solutions

Beyond the core: Tackling system-wide debugging for complex SoCs with Tessent UltraSight

December 15, 2025

Tessent UltraSight enables system-wide debugging for complex SoCs. A comprehensive solution, it combines embedded hardware IP with powerful host software to provide deep visibility into complex SoCs, supporting the development and optimization of high-performance embedded software.

By Tessent Solutions

Semiconductor Packaging

Key Thermal Advances Driving Next-Gen AI Chip Design in 2026

December 15, 2025

AI is hot — literally. As we bid farewell to a transformative year of 2025, there’s no doubt that the AI chip underwent substantial changes. As AI compute is pushing...

By Andras Vass-Varnai

Electronic Systems Design

Why the engineer’s design journey is becoming the new competitive battleground

December 10, 2025

Many hardware engineers today navigate an increasingly fragmented digital landscape. The white paper discusses design enablement as a modern solution — one that transforms component manufacturers from passive content providers into active design partners.

Edge AI Transforming Industrial Internet of Things

December 10, 2025

The Industrial Internet of Things (IIoT) is evolving rapidly, and Edge AI has emerged as one of its most transformative...

By Mary Rayburn