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Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

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Calibre IC Design & Manufacturing

Calibre IC Manufacturing in 2025: The year’s biggest news

January 29, 2026
Read about 2025 highlights from Siemens Calibre IC Manufacturing group, including advances in computational metrology, monotonic machine learning, AI, EUV and GPU acceleration
By Calibre IC Design & Manufacturing
4 MIN READ

EDA Support Blogs

Redefining Adaptability: Tessent Vector Callbacks for Superior Semiconductor Test Customization

January 28, 2026
In the rapidly evolving field of semiconductor testing, the ability to adapt and optimize test strategies is crucial for achieving...
By Jyo Sanda
2 MIN READ

Electronic Systems Design

ECAD/MCAD collaboration is no longer optional — it’s survival 

January 27, 2026
In this episode of the Printed Circuit Podcast, host Steph Chavez welcomes two long-time friends and PCB design veterans —...
By Arlina Yang
2 MIN READ

Electronic Systems Design

Etch effects exposed: discover where your copper really goes

January 27, 2026
Etching inner layers involves cleaning the copper on both sides of the piece of laminate, applying a photoresist, exposing the photoresist to create the inner layer pattern, developing the resist, etching away the unwanted copper, and removing the etch resist. This process is automated in most shops and the chemistry is automatically monitored. As a result, the accuracy and repeatability is quite good. It is possible to etch inner layer traces using this process to an accuracy of ±0.5 mils. This accuracy control helps keep impedance within the tolerances required for transmission lines.
By Bill Hargin
8 MIN READ

Semiconductor Packaging

Thermal management in 3D IC: Challenges, modeling and design strategies 

January 26, 2026
You are likely here because thermal issues have become the primary constraint shaping your 3D IC design decisions. As 3D integration pushes more performance into smaller footprints, thermal...
By Tova Levy
5 MIN READ

Electronic Systems Design

Accelerating the search through millions of “what if” scenarios

January 26, 2026
HyperLynx Design Space Exploration can help you optimize your design’s performance by exploring a very large design space in a fraction of the time required with traditional methods.
By Sajeda Tamimi
3 MIN READ

Electronic Systems Design

ASTER Technologies strengthens Siemens digital thread for optimized PCB manufacturability

January 22, 2026
Siemens EDA is pleased to announce its acquisition of ASTER Technologies, a trusted name within the PCB design industry with more than...
By Patrick Hope
4 MIN READ

Calibre IC Design & Manufacturing

ESD verification in 3D ICs: Navigating unseen risks and new realities

January 21, 2026
Discover best practices for automated 3D IC ESD verification using Calibre 3DPERC. Learn how to address the unique challenges of ESD protection in advanced 3D IC designs and ensure system-level reliability.
By Calibre IC Design & Manufacturing
5 MIN READ

Semiconductor Packaging

Ensure 3D IC Multiphysics Reliability for AI Systems at Scale

January 18, 2026
Every new generation of AI systems pushes SoC design teams closer to the end of Moore’s Law. The core question...
By Tova Levy
6 MIN READ

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