Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

Semiconductor Packaging

3D IC hardware security: a designer's checklist

August 03, 2026

Guest author: Chris Jones, Director Of Applications at Crypto Quantique. In the rapidly evolving world of semiconductor design, 3D integrated...

Electronic Systems Design

Single Event Effects (SEE) in Rad-Hard components with HyperLynx AMS

What makes SEEs particularly challenging is that they can't be stopped by traditional physical shielding, making Radiation-Hardened (Rad-Hard) components essential for systems operating in harsh environments like space or military applications.

By Sajeda Tamimi

Electronic Systems Design

Engineering concurrency: The future of collaborative PCB design

For decades, electronic product development followed a familiar sequence. System architects defined requirements, electrical engineers developed schematics, PCB designers created...

By Stephen V. Chavez

Cre8Ventures (Siemens EDA)

From Physical Reality to Engineering Intelligence

Siemens Cre8Ventures and Solaya collaborate to accelerate Europe’s next generation of Physical AI and Digital Twins. The future of industrial...

By Carson Bradbury

Self-verifying, long-running EDA AI agents that engineers can trust

At DAC 2026, we announced self-verifying, long-running EDA AI agents for semiconductor and PCB design, in collaboration with NVIDIA.

By Emma-Jane Crozier

Calibre IC Design & Manufacturing

Interactive symmetry checking with Calibre RealTime accelerates analog IC design

Learn how Calibre RealTime enables interactive symmetry checking in analog IC design with instant validation, zero setup and early detection to compress schedules and reduce costly rework

By Calibre IC Design & Manufacturing

Semiconductor Packaging

Streamlining 3D IC design: A complete eBook series for building smarter, faster, and more predictable 3D IC workflows

Explore the full Streamlining 3D IC design eBook series and discover how Siemens methodologies and tools can help your team accelerate innovation, improve design quality, and manage the complexity of advanced 2.5D and 3D IC development.

By Keith Felton

Cre8Ventures (Siemens EDA)

Siemens Cre8Ventures and Cloudberry VC Partner to Accelerate Europe’s Deep-Tech Innovation

Europe is home to world-leading research in semiconductors, photonics, quantum technologies, AI hardware and advanced engineering. Yet many breakthrough technologies...

By Carson Bradbury

Hardware Assisted Verification

Innexis ANA Now Available in AWS Marketplace: Accelerating Cloud-Native Software Development for Complex SoCs

We’re excited to announce that Innexis™ Architecture Native Acceleration (ANA) is nowavailable in AWS Marketplace, making it easier than ever...