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Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

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Semiconductor Packaging

Beyond the limits of silicon: Why 3D IC is the next frontier of innovation

September 17, 2026
Guest author: Bob Patti, President of NHanced Semiconductors For decades, the semiconductor industry followed a predictable rhythm: shrink the transistors,...
By Tova Levy
2 MIN READ
Semiconductor Packaging

Streamlining 3D IC design with Innovator3D IC product family release 2604.0004

September 02, 2026
Release 2604.0004 (available now on Support Center) brings a number of design capabilities and productivity enhancements further enhancing Innovator3D IC...
By Keith Felton
2 MIN READ
Calibre IC Design & Manufacturing

How shift-left memory contention analysis protects performance and schedule

September 01, 2026
Detect memory contention at the schematic level, optimize memory design and improve reliability with Insight Analyzer—advanced analysis for complex memory blocks
By Calibre IC Design & Manufacturing
6 MIN READ
Calibre IC Design & Manufacturing

Manufacturing Intelligence: AI in the Fab

September 01, 2026
Discover how AI is fundamentally transforming semiconductor manufacturing, moving beyond traditional limits. Learn how AI tightens feedback loops, tackles bottlenecks, and orchestrates fab operations for unprecedented efficiency and innovation.
By Calibre IC Design & Manufacturing
4 MIN READ
Semiconductor Packaging

Two systems, one goal: understanding PLM vs. IPLM in 3D IC design

September 01, 2026
Guest author: Vishal Moondhra, VP of Solutions Engineering for Perforce IPLM Your team just made a critical design change to...
By Tova Levy
5 MIN READ
Calibre IC Design & Manufacturing

Why curvilinear OPC demands a new optimization approach 

August 24, 2026
The semiconductor industry’s transition to sub-5 nm nodes has fundamentally changed photomask design economics. For years, teams relied on rectilinear...
By Calibre IC Design & Manufacturing
6 MIN READ
Electronic Systems Design

AI in PCB design: hype or the future of engineering?

August 24, 2026
The world of electronics design is constantly evolving, and few topics are generating as much buzz (and sometimes apprehension) as...
By Regan Sumy
5 MIN READ
Calibre IC Design & Manufacturing

From chaos to clarity: Smarter DRC workflows and team productivity with Calibre Vision AI 

August 20, 2026
Advanced node DRC demands rapid team coordination and closure. You can transform your entire DRC workflow by turning massive error data into...
By Calibre IC Design & Manufacturing
5 MIN READ
Electronic Systems Design

Proactive BOM analysis for supply chain resilience

August 20, 2026
BOM risk has become a critical design constraint, where a single part shortage can trigger weeks of redesign churn and...
By David Haboud
4 MIN READ

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