Illustrative example of 3D IC heat dissipation - thermal management

IC package thermal resistance: Accurate modeling for system-level IC thermal reliability

As semiconductor devices grow more powerful and complex, effective thermal management has become a top priority in IC design. With…

ic package type

Ultimate guide to IC package types: choose the right package technology

Integrated circuits (ICs) are the foundation of modern electronics, powering everything from smartphones and medical devices to servers and automotive…

3d ic stacked chip

2.5D vs. 3D IC: which chip packaging technology is right for you?

Why 2.5D vs. 3D IC matters in modern chip design As semiconductor innovation pushes the limits of Moore’s Law, traditional…

3D IC rendering illustrating advanced chip packaging with vertically stacked dies

Chip packaging explained: From IC packaging basics to advanced 2.5D and 3D IC technologies

Understanding the evolution and importance of chip packaging As semiconductor innovation pushes the boundaries of performance and power efficiency, chip…

Illustration of 3D IC stacked design

3D IC technology: your comprehensive guide to enabling heterogeneous integration

What is 3D IC technology? 3D IC technology refers to the integration of multiple silicon dies or wafers in a…

The beginner’s guide to 3D IC

The beginner’s guide to 3D IC

Why 3D IC technology matters As consumer electronic devices grow increasingly connected, intelligent, and advanced, designers need new methodologies like…