News - Semiconductor Packaging

User2User 2024: Chiplets for future automotive application: Fraunhofer

September 11, 2024

Andy Heinig, Head of Department Efficient Electronics at Fraunhofer, explains why automotive is especially a good market and enabler for chiplets and presents different use cases for chiplets that are on the horizon.

By John McMillan

3 MIN READ

The evolution of machine learning (ML) in the physical design and verification of semiconductor packages

August 14, 2024

Discover how Siemens’ EDA evolution of machine learning in the physical design and verification of semiconductor packages.

By John McMillan

2 MIN READ

User2User 2024: EMIB based advanced packaging flow – Intel Foundry

August 12, 2024

Learn how Intel uses 3DIC verification to leverage Siemens XSI & Calibre 3DSTACK for DRC, LVS, assembly checks. Explore methodologies for high-performance systems.

By John McMillan

3 MIN READ

Why is a comprehensive workflow essential for chiplet design and today’s 3D IC architectures?

August 8, 2024

Explore this infographic to learn why a comprehensive workflow essential for chiplet design and today’s 3D IC architectures.

By John McMillan

2 MIN READ

Siemens introduces Innovator3D IC – a comprehensive multiphysics cockpit for 3D IC design, verification and manufacturing

July 31, 2024

Innovator3D IC – a comprehensive multiphysics cockpit for 3D IC design, verification and manufacturing

By John McMillan

4 MIN READ

User2User 2024: xPD xSI PDK design enablement – Beyond Xpedition templates

July 30, 2024

PDK enablement beyond using Expedition templates, focusing on the challenges and solutions related to updating packaging tool functionality.

By John McMillan

2 MIN READ

The role of AI-infused EDA solutions for semiconductor-enabled products and systems

July 23, 2024

Discover why semiconductor-enabled products and systems are demanding AI-infused solutions and how AI is changing the nature of semiconductor design.

By John McMillan

2 MIN READ

Discover how AI is changing the nature of semiconductor design

July 16, 2024

AI is shaping the semiconductor industry’s future and its alignment with Siemens’ commitment to innovation and enhancing sustainability by accelerating…

By John McMillan

2 MIN READ

Assembly Verification Flow for Silicon Interposers with Embedded Deep Trench Capacitance

User2User 2024: Assembly verification flow for silicon interposers

July 15, 2024

In this User2User 2024 session Broadcom’s Suvarna Vikhankar presents “Assembly Verification Flow for Silicon Interposers with Embedded Deep Trench Capacitance”

By John McMillan

2 MIN READ