The 2409 release is a landmark update in the field of electronic design automation (EDA), introducing a next-generation solution for…
The TSMC 2024 North America OIP (Open Innovation Platform®) Ecosystem Forum is just around the corner, and Siemens EDA is…
Efficiency in IC package design is becoming more important as design cycles shorten and complexity surges. One common approach to…
In the world of package substrate design, the age-old saying, “many hands make light work,” holds more truth than ever….
The utilization of High Bandwidth Memory (HBM) has become a cornerstone for high performance computing (HPC) CPUs, GPUs, and AI…
The demand for increased power and performance in semiconductor packages has surged. As more die and chiplets are integrated into…
Designing advanced package layouts with large areas of metal can be a daunting task, given the stringent requirements imposed by…
The new VX.2.14 release of Xpedition IC Packaging includes improvements and enhancements to both Xpedition Substrate Integrator and Xpedition Package…
We have witnessed and learned about the industry’s significant shift in semiconductors. The traditional approach of transistor scaling, once universally…
