Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

Tessent Solutions

Message-based connections enable system-level debug and validation

October 28, 2022

Secure Message Infrastructure is a scalable, message-based on-chip communications fabric that facilitates system-level debug and validation by allowing configuration of on-chip Embedded Analytics IP, cross-triggering and data capture

By andy.gothard

Electronic Systems Design

Variant management in the PCB design process

October 28, 2022

It’s typical for today’s electronic products to have different producible versions or variants. This is because a product may need...

Semiconductor Packaging

Importance of early planning for interconnect verification in 3D IC physical design workflows

October 24, 2022

In our last podcast on 3D IC architecture workflows, we discussed how a system or microarchitectures determine how to partition...

By Heather George

Tessent Solutions

How to master DFT for tile-based designs

October 23, 2022

Hierarchical designs that are tile-based or abutment based physical blocks are predominant in today’s chips. Having no logic present at the chip-level calls for new approaches to testing these tile-based architectures. How a design for test (DFT) architecture can support tile-based designs is the focus of this presentation from U2U 2022.

By Tessent Solutions

Tessent Solutions

Explore a new way to measure heterogenous SoC performance at the Linley Fall Processor Conference

October 22, 2022

Join Siemens at the Linley Fall Processor Conference, the two-day event focusing on processors and IP cores used in embedded, communications, automotive, IoT, and server designs.

By Tessent Solutions

Tessent Solutions

Tessent at ISTFA 2022

October 21, 2022

Join Tessent at the 48th International Symposium for Testing and Failure Analysis, the premier event for the microelectronics failure analysis community.

By Tessent Solutions

S-parameters simplified!

October 19, 2022

IC designers experiment various circuit architectures to realize their circuits in order to meet the required functional performance specifications, while...

By Pradeep Thiagarajan

Semiconductor Packaging

The five keys to next-generation IC packaging design: Part 2

October 19, 2022

Multi-domain integration enables faster time to market for complex advanced semiconductor packages with a seamless integration of design and verification.

By Keith Felton

Electronic Systems Design

Top 5 rigid-flex design guidelines

October 18, 2022

Rigid-flex DFM I am not sure if you have seen a rigid-flex circuit before, but I bet you must have...