Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

Semiconductor Packaging

What is 3Dblox?

January 13, 2026

If you have not heard of it before, 3Dblox is an emerging standard that was first created by TSMC but is now managed by IEEE.

By Keith Felton

Hardware Assisted Verification

Veloce Cloud Capacity

January 12, 2026

Capacity at your fingertips — A flexible, scalable, turnkey solution for cloud access to Veloce emulation capacity. Veloce Cloud Capacity provides...

By lisa.hartman

Calibre IC Design & Manufacturing

Calibre IC Design in 2025: AI, 3D IC advancement and shift-left strategies drive verification excellence

January 12, 2026

Read about 2025 IC Design highlights from Siemens Calibre, including AI-powered verification and debug, 3D IC innovations, and shift-left strategies supporting accelerated tapeouts.

By Calibre IC Design & Manufacturing

EDA Support Blogs

Boundary Scan Evolved: Enabling Hierarchical Designs with Tessent EBSCAN

December 29, 2025

Boundary scan is an integral part of electronic circuit design, be it system level, PCB level, chip level or physical...

How NXP Achieved Robust Verification and Portfolio Re-characterization of Liberty IP with Solido Characterization Suite

December 23, 2025

At the Design Automation Conference (DAC), Siemens EDA and NXP collaborated to showcase innovative methodologies that directly address two of the most critical challenges in library characterization: accelerating Liberty (.lib) characterization and verification. Together, we presented solutions that redefine traditional approaches, creating efficient and reliable workflows that advance NXP’s design process.

By Ray Valencia

Accelerating TRNG Verification: Microsoft-Siemens EDA Breakthrough Simulation Methodology at DAC

December 23, 2025

From 1.5-year simulation bottlenecks to verification in days, Microsoft and Siemens EDA's collaboration eliminates one of the biggest roadblocks in hardware security verification.

By Emma-Jane Crozier

Cre8Ventures (Siemens EDA)

IMCHIP Joins the Siemens Cre8Ventures Digital Twin Marketplace

December 23, 2025

Advancing Sovereign, Energy-Efficient AI for Drones Siemens Cre8Ventures is pleased to announce that IMCHIP has joined the Siemens Cre8Ventures Digital...

By Carson Bradbury

Electronic Systems Design

When design meets manufacturing: Why the digital thread and digital twin are leadership imperatives

December 22, 2025

When design and manufacturing operate without a cohesive digital twin, the consequences ripple across the enterprise.

By Stephen V. Chavez

Tessent Solutions

Beyond the core: Tackling system-wide debugging for complex SoCs with Tessent UltraSight

December 15, 2025

Tessent UltraSight enables system-wide debugging for complex SoCs. A comprehensive solution, it combines embedded hardware IP with powerful host software to provide deep visibility into complex SoCs, supporting the development and optimization of high-performance embedded software.

By Tessent Solutions