Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

Hardware Assisted Verification

Early Software Prototyping: Mitigating Risks Before Silicon

August 27, 2025

Transform software verification: Find and fix critical issues months before silicon

By Zaid Rodriguez

Electronic Systems Design

Keeping your IP safe in a connected world

August 19, 2025

Protecting electronic design IP isn't just about having the right tools—it's about cultivating a mindset across your organization.

By Stephen V. Chavez

Semiconductor Packaging

Navigating signal integrity and power integrity (SI/PI) in 3D IC design

August 19, 2025

Q: Is dedicated SI/PI analysis still necessary in 3D IC design? A: With the rapid advancements in chip design automation...

By John McMillan

Semiconductor Packaging

IC package thermal resistance: Accurate modeling for system-level IC thermal reliability

August 19, 2025

As semiconductor devices grow more powerful and complex, effective thermal management has become a top priority in IC design. With...

By John McMillan

Cre8Ventures (Siemens EDA)

Announcing the Siemens Cre8Ventures Open Higher Education Program — with Arm and the University of Southampton as launch partners

August 14, 2025

Siemens Cre8Ventures announces its open Higher Education Program (HEP). Europe’s once-in-a-generation #EUChipsAct opportunity has arrived — and with it, a...

By Carson Bradbury

Electronic Systems Design

Copper thickness: Closing the knowledge gap to design success

August 13, 2025

Copper thickness determination of rolled and electro-deposited (ED) copper foil by weight provides far more accuracy than contact-thickness gauges. Since the topography of treated foil varies greatly, and since the density of copper is known, weighing a 1-by-1 foot sheet is the best way to determine the average thickness of a sheet of copper. So formally, the unit that we refer to as “ounces” is actually ounces per square foot.

Design with Calibre

Revolutionizing 3D IC design with integrated multiphysics verification

August 12, 2025

By Yoyo Li The semiconductor landscape is always evolving—sometimes quietly, sometimes at breakneck pace. Today, as integrated circuit designs progress...

By Design With Calibre

Semiconductor Packaging

The Missing Piece for Chiplet Success

August 11, 2025

Chiplets are revolutionizing the semiconductor industry, enabling unprecedented levels of integration, performance, and flexibility. By breaking complex designs into smaller,...

Semiconductor Packaging

How to Design Smarter: System-level multiphysics in 3D integration

August 07, 2025

What happens when a perfectly functioning chip fails to perform in a 3D IC package? As semiconductor designs stack multiple...

By John McMillan