Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

Electronic Systems Design

How effective is decoupling capacitance in power distribution networks?

September 09, 2025

The power distribution network (PDN) is especially important as devices can draw immense current leading to unwanted voltage drops at power supply pins, compromising device operation and reliability.

Semiconductor Packaging

Breaking down 50 million pins: A smarter way to design 3D IC packages

September 03, 2025

As 3D IC complexity skyrockets, are we truly evolving our design methodologies at the same pace, or are we unknowingly...

By John McMillan

Design with Calibre

Enhancing IC Verification: Smarter solutions for faster, more reliable designs

September 02, 2025

By Jonathan Muirhead Modern chip layouts are more intricate than ever, incorporating a mix of custom and third-party intellectual property...

By Design With Calibre

Accelerating Digital Design: New Library Generation and Analysis Flows from Google-Siemens EDA Collaboration at DAC

August 29, 2025

From rapid library generation to precise analytics, Google and Siemens EDA's latest collaboration presented at DAC tackles some of the biggest challenges in mobile SoC development.

By Emma-Jane Crozier

Hardware Assisted Verification

Early Software Prototyping: Mitigating Risks Before Silicon

August 27, 2025

Transform software verification: Find and fix critical issues months before silicon

By Zaid Rodriguez

Electronic Systems Design

Keeping your IP safe in a connected world

August 19, 2025

Protecting electronic design IP isn't just about having the right tools—it's about cultivating a mindset across your organization.

By Stephen V. Chavez

Semiconductor Packaging

Navigating signal integrity and power integrity (SI/PI) in 3D IC design

August 19, 2025

Q: Is dedicated SI/PI analysis still necessary in 3D IC design? A: With the rapid advancements in chip design automation...

By John McMillan

Semiconductor Packaging

IC package thermal resistance: Accurate modeling for system-level IC thermal reliability

August 19, 2025

As semiconductor devices grow more powerful and complex, effective thermal management has become a top priority in IC design. With...

By John McMillan

Cre8Ventures (Siemens EDA)

Announcing the Siemens Cre8Ventures Open Higher Education Program — with Arm and the University of Southampton as launch partners

August 14, 2025

Siemens Cre8Ventures announces its open Higher Education Program (HEP). Europe’s once-in-a-generation #EUChipsAct opportunity has arrived — and with it, a...

By Carson Bradbury