Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

Electronic Systems Design

Adapt to Design - Design for manufacturing

December 20, 2023

Design for manufacturing, or DFM, is a crucial aspect of electronics manufacturing best practices. It emphasizes that each printed circuit...

By Paul Carpine

Electronic Systems Design

What’s New in Valor NPI 2311

December 19, 2023

Each new Valor NPI release brings exciting features and improvements, and Valor NPI version 2311 is no different. One of the most prominent recent changes for release 2311 is the 3D board viewer. This allows users to toggle between the typical 2-D board view, and a 3-D board view. While less visually prominent, the addition of high-risk component detection is no less impactful among the overall improvements. The Valor Parts Library now associates individual components with a manufacturing risk value. This allows you to consider at-a-glance relative yield values based on component choices. Valor NPI version 2311 also facilitates the placement of XD components in a zigzag array.

Tessent Solutions

Three ways to slash AI chip TTM with advanced DFT and silicon bring-up

December 19, 2023

Advanced EDA technology eases AI chip development.

By Lee Harrison

Semiconductor Packaging

System-level, post-layout electrical analysis for high-density advanced packaging (HDAP)

December 18, 2023

HDAP designs like FOWLP need post-layout simulation (analog) and post-layout STA (digital) flows to augment basic physical verification DRC and LVS.

By John McMillan

Calibre IC Design & Manufacturing

3DICs and the multi-physics challenge

December 11, 2023

By John Ferguson Design teams have known since, well, pretty much forever that mechanical stresses and temperature changes can affect...

By Calibre IC Design & Manufacturing

Semiconductor Packaging

Crossing the chasm: Bringing SoC and package verification together

December 08, 2023

3D IC package designers need assembly-level LVS for HDAP verification.

By John McMillan

The Resurgence of Japan's Semiconductor Industry

December 07, 2023

The History of Semiconductors in Japan Japan has a rich history of innovation in the semiconductor industry. During the 1980s...

By Lih-Jen Hou, Pradeep Thiagarajan

Exploring production-proven AI-powered EDA solutions with Solido Design Environment

December 07, 2023

Note: If you’re interested in knowing more about Solido Design Environment, check out this executive video by Amit Gupta, VP...

By Mohamed Atoua

Semiconductor Packaging

Package designers need assembly-level LVS for HDAP verification

December 05, 2023

While advanced integrated circuit (IC) packaging is a fast-growing market, comprehensive package verification still has a ways to go. Unique...

By John McMillan