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Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

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Semiconductor Packaging

Five Key Trends of Co-Packaged Optics (CPO) in 2026

February 05, 2026
For years, data-center performance scaled by following a familiar playbook: faster GPUs, higher SerDes rates, and increasingly aggressive board designs....
By Tony Mastroianni
5 MIN READ

Semiconductor Packaging

Six Key Trends Redefining 3D IC Packaging in the AI Era

February 05, 2026
Some say we are officially in the Post-Moore’s Law world.  Moore himself closed his seminal paper by mentioning the “day...
By Pratyush Kamal
5 MIN READ

Semiconductor Packaging

Verifying your 2.5/3D IC device assembly level netlist

February 04, 2026
In this blog we will introduce a new way to verify your 2.5/3D IC device assembly level netlist using formal verification that can exhaustively verify all interconnections between the chiplet blocks.
By Keith Felton
3 MIN READ

Calibre IC Design & Manufacturing

Siemens acquires Canopus AI: Supercharging semiconductor manufacturing with AI-powered metrology

February 04, 2026
Siemens acquires Canopus AI to advance semiconductor manufacturing with AI-powered metrology and inspection, boosting precision, efficiency, and yield.
By Calibre IC Design & Manufacturing
4 MIN READ

Electronic Systems Design

Elevating enterprise project success: The power of managed design review workflows in PCB design

February 04, 2026
A single error in a PCB layout can lead to costly re-spins, significant project delays, and even product failure in the field. Enter managed design review workflows for PCB design.
By Stephen V. Chavez
4 MIN READ

Electronic Systems Design

Cloud-native PCB design: a new era of agility, security, and scale 

February 03, 2026
In this episode of the Printed Circuit Podcast, guest host Matthew Walsh — stepping in while Steph Chavez attends PCB West — welcomes Adam...
By Arlina Yang
3 MIN READ

Electronic Systems Design

Minimizing insertion loss: Why understanding trace width is critical at high frequencies

February 03, 2026
Material matters An engineer asked me recently about the relationship between trace width and insertion loss while adjusting dielectric height...
By Bill Hargin
5 MIN READ

EDA Consulting Services

Functional Safety Whitepaper: Developing Safety Architectures for AI Accelerators

February 02, 2026
AI accelerator chips such as NPUs and GPUs are increasingly used in safety‑critical systems, but their massively parallel architectures (simplified...
By Consulting Services
2 MIN READ

Calibre IC Design & Manufacturing

Calibre IC Manufacturing in 2025: The year’s biggest news

January 29, 2026
Read about 2025 highlights from Siemens Calibre IC Manufacturing group, including advances in computational metrology, monotonic machine learning, AI, EUV and GPU acceleration
By Calibre IC Design & Manufacturing
4 MIN READ

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