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Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

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Electronic Systems Design

What’s new in Z-planner Enterprise 2504

August 04, 2025
Z-planner Enterprise 2504 release The latest 2504 release of Z-planner Enterprise delivers powerful updates that streamline stackup planning, improve rigid-flex...
By Patrick Hope
3 MIN READ

Electronic Systems Design

How to have actionable DFM reviews: Unlocking digital manufacturing for SMBs with PCBflow and Xpedition Standard

July 29, 2025
With the release of Xpedition Standard, Siemens is delivering actionable DFM reviews that empower SMB teams to design with confidence.
By David Haboud
3 MIN READ

Electronic Systems Design

What’s new in Valor NPI 2504

July 28, 2025
The latest Valor NPI 2504 release delivers powerful enhancements that make your Design for Manufacturing (DFM) analysis faster, more intelligent,...
By Patrick Hope
3 MIN READ

Semiconductor Packaging

Ultimate guide to IC package types: choose the right package technology

July 28, 2025
Integrated circuits (ICs) are the foundation of modern electronics, powering everything from smartphones and medical devices to servers and automotive...
By John McMillan
6 MIN READ

Design with Calibre

How to boost reliability with early-stage reliability checks

July 23, 2025
By Chun-hsiang Chang The rapid expansion of AI-powered consumer electronics is pushing IC manufacturing to the sub-2 nm frontier. To...
By Design With Calibre
4 MIN READ

Custom IC

Forging the future of library verification with AI Powered Custom IC Design and Verification Solutions

July 22, 2025
In a compelling presentation that captivated audiences at the Siemens User2User North America 2025 Conference, Dongsuk Lee, Principal Engineer at Samsung...
By Neel Natekar
2 MIN READ

Electronic Systems Design

Unlocking the power of 3D component digital twins for SMB and individuals

July 22, 2025
Leveraging component digital twins—virtual representations of physical components that provide comprehensive information about their characteristics and behaviors.
By David Haboud
2 MIN READ

Semiconductor Packaging

​Why 3D ICs need a mindset shift and how to make it happen

July 17, 2025
What if the most revolutionary advances in semiconductor design aren’t about making things smaller, but about fundamentally reimagining how we...
By John McMillan
17 MIN READ

Design with Calibre

Navigating 3D IC stress: physical realities and best practices for 3D IC reliability

July 16, 2025
By Shetha Nolke As the semiconductor industry shifts toward heterogeneous 3D ICs, exciting benefits are coming within reach—from smaller footprints...
By Design With Calibre
5 MIN READ

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