Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

Google team accelerates high-sigma bitcell validation with Solido Design Environment

Google’s Akash Jha shares how his team deploys Solido AI-powered technologies at the Custom IC Forum in Bangalore. This September,...

By Jayne Alexander

Calibre IC Design & Manufacturing

The engineering talent pipeline: How Siemens is helping to build tomorrow's workforce

Siemens EDA recognizes that the future of manufacturing depends on a robust pipeline of skilled talent. That’s why we have partnered with ChipsHub to be part of a comprehensive workforce development ecosystem

By Calibre IC Design & Manufacturing

Cre8Ventures (Siemens EDA)

Embedded Trust for Autonomous Industrial Systems

From Connected Automation to Verifiable Autonomy Siemens Cre8Ventures, the University of Southampton and Minima have demonstrated a new industrial capability:...

By Carson Bradbury

Electronic Systems Design

Mastering the PCB designer's triangle: Broad embedded verification for enterprise PCB excellence

Master the PCB designer's triangle for successful enterprise-wide verification.

By Stephen V. Chavez

Semiconductor Packaging

Advanced thermal design strategies for 3D IC systems

February 27, 2026

Not long ago, OpenAI CEO Sam Altman remarked that advanced AI video generation workloads were pushing GPUs toward their thermal limits....

Electronic Systems Design

Breaking down bottlenecks: rethinking design reviews for modern electronics development

February 26, 2026

To unlock progress, design reviews must become more than just validation checkpoints. They need to operate as structured, collaborative workflows that help teams move faster, reduce rework, and keep design intent aligned across engineering, manufacturing, and sourcing from start to finish.

By David Haboud

How Analogix utilized Solido SPICE to overcome verification challenges in creating high-quality PLLs

February 20, 2026

Analogix Semiconductor is a global provider of mixed-signal semiconductors, committed to advancing display quality on mobile devices while maximizing battery...

How Symphony Pro is defining the future of mixed-signal verification for high-speed die-to-die interfaces: A case study by AnalogPort

February 20, 2026

A modern chiplet interface contains millions of transistors, thousands of control signals, and dozens of ultra-sensitive analog blocks, all of...

By Neel Natekar

Semiconductor Packaging

The smart path to STCO with Hierarchical Device Planning (HDP)

February 20, 2026

Siemens partnered with Intel Foundry to develop a STCO centric capability that enables a “smart path” to homogeneous disaggregation using Hierarchical Device Planning and parameterized pin regions.

By Keith Felton