Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

Semiconductor Packaging

What Lies Ahead for System-Technology Co-Optimization (STCO) in 2026

January 15, 2026

The race to build ever more powerful and energy-efficient AI chips has been underway for years, but 2026 is shaping...

Semiconductor Packaging

AI is reshaping the 3D IC design ecosystem: Key trends to watch in 2026

January 15, 2026

Headlines on how the global AI race leads to the shortages of GPUs in no short supply. Behind those headlines...

By Sudarshan Deo

Electronic Systems Design

Design smarter, not harder: Evolving design reuse methodologies in EDA

January 14, 2026

In this episode of the Printed Circuit Podcast, host Steph Chavez explores the growing impact of design reuse in electronic design automation (EDA),...

Electronic Systems Design

From fragmented to connected: Rethinking the electronics design journey

January 13, 2026

How digital design threads connect concept, design, and manufacturing to reduce risk, rework, and time to market.

By David Haboud

Semiconductor Packaging

What is 3Dblox?

January 13, 2026

If you have not heard of it before, 3Dblox is an emerging standard that was first created by TSMC but is now managed by IEEE.

By Keith Felton

Hardware Assisted Verification

Veloce Cloud Capacity

January 12, 2026

Capacity at your fingertips — A flexible, scalable, turnkey solution for cloud access to Veloce emulation capacity. Veloce Cloud Capacity provides...

By lisa.hartman

Calibre IC Design & Manufacturing

Calibre IC Design in 2025: AI, 3D IC advancement and shift-left strategies drive verification excellence

January 12, 2026

Read about 2025 IC Design highlights from Siemens Calibre, including AI-powered verification and debug, 3D IC innovations, and shift-left strategies supporting accelerated tapeouts.

By Calibre IC Design & Manufacturing

EDA Support Blogs

Boundary Scan Evolved: Enabling Hierarchical Designs with Tessent EBSCAN

December 29, 2025

Boundary scan is an integral part of electronic circuit design, be it system level, PCB level, chip level or physical...

How NXP Achieved Robust Verification and Portfolio Re-characterization of Liberty IP with Solido Characterization Suite

December 23, 2025

At the Design Automation Conference (DAC), Siemens EDA and NXP collaborated to showcase innovative methodologies that directly address two of the most critical challenges in library characterization: accelerating Liberty (.lib) characterization and verification. Together, we presented solutions that redefine traditional approaches, creating efficient and reliable workflows that advance NXP’s design process.

By Ray Valencia