Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

Electronic Systems Design

PCB high voltage spacing: What every engineer should know

At the heart of high-voltage PCB reliability is proper PCB high voltage spacing between conductive elements.

By Stephen V. Chavez

Semiconductor Packaging

What’s new in IC Packaging 2504

To help design teams stay ahead of the curve, Siemens has released the comprehensive 2504 update for its Innovator3D IC (i3D) and Xpedition Package Designer (xPD) solutions.

By Keith Felton

Electronic Systems Design

What’s new in HyperLynx 2504

The HyperLynx 2504 update introduces a wealth of new features and enhancements that elevate the PCB design process.

Electronic Systems Design

What’s new in Xpedition Enterprise 2504

Building on the core 2409 release, where we introduced the concept of the next generation of electronic systems design, the Xpedition Enterprise 2504 release continues to enhance and expand this vision.

EDA Support Blogs

Tessent BISR controller doing a lot more than memory repair

The BISR controller is at the heart of the Tessent Platform repair solution. It facilitates access to the BISR chains...

By Lincoln McLoud

Electronic Systems Design

Beyond silos: Enabling multidomain and multidiscipline integration in electronic systems design

Engineering success depends not just on deep expertise, but on seamless integration across domains and disciplines.

By Stephen V. Chavez

Heading to DAC 2025 with Microsoft: Novel TRNG Verification with a High-Performance Simulation Methodology

In our data-driven world, the need for robust security solutions continues to grow. At the heart of modern cryptographic systems...

Tessent Solutions

Shift Left in DFT Design

Tessent™ RTL Pro software automates the analysis and insertion of Tessent VersaPoint™ test point technology, LBIST-OST test points, dedicated scan wrapper cells and x-bounding logic as behavioral code at the RTL level. Tessent RTL Pro builds on Tessent’s market-leading DFT tools by providing unique functionality that helps customers shorten design turnaround time and accelerate time-to-market.

By Jayne Scheckla

Design with Calibre

Solving inter-domain leakage challenges: Enhancing IC design with Insight Analyzer

By Charlie Olson Design reliability remains a top priority for engineers in the world of semiconductor technology. One critical challenge...

By Design With Calibre