Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

Electronic Systems Design

Introducing: PADS Pro Essentials

We are excited to introduce PADS Pro Essentials, a transformative PCB design offering that brings the power of Xpedition technology within reach of independent engineers and small projects, without the hefty price tag or steep learning curve.

By David Haboud

Semiconductor Packaging

3D IC technology trends: how advanced IC packaging is changing the semiconductor industry

The semiconductor industry is rapidly evolving with 3D IC technology and advanced packaging solutions revolutionizing chip design and manufacturing. In...

By John McMillan

Design with Calibre

Overcoming noise challenges in analog and RF circuit design with Calibre PERC net shielding

By Hossam Sarhan Communication has become the backbone of everything from personal routines to industry, and the demand for analog...

By Design With Calibre

Semiconductor Packaging

3D IC technology: your comprehensive guide to enabling heterogeneous integration

What is 3D IC technology? 3D IC technology refers to the integration of multiple silicon dies or wafers in a...

By John McMillan

Siemens’ Solido Custom IC and TSMC Collaborate to Enable Advanced Process Node Verification

After an extensive qualification process, Analog FastSPICE (AFS), part of Solido™ Simulation Suite, has achieved certification for TSMC’s N2P and A16 process nodes. Solido SPICE also achieved qualification for these technology nodes, meeting TSMC’s accuracy requirements.

By Emma-Jane Crozier

Design with Calibre

Calibre xACT takes a hybrid approach to parasitic extraction

By Mark Tawfik Parasitic extraction plays a pivotal role in the design and optimization of integrated circuits (ICs). Extraction involves...

By Design With Calibre

Cre8Ventures (Siemens EDA)

Xiphera Partners with Siemens Cre8Ventures to Strengthen Automotive Security and Support EU Chips Act Sovereignty Goals

Siemens Cre8Ventures is excited to announce its new partnership with Xiphera, a leading provider of hardware-based cryptographic solutions, through the...

By Carson Bradbury

Semiconductor Packaging

Resolving Design Fragmentation Challenges in Chiplet Integration with STCO

Are you struggling to integrate chiplets into an advanced packaging platform due to design fragmentation challenges? The complexity of managing...

Electronic Systems Design

16 PCB experts to follow in 2025

Staying ahead in the fast-evolving world of PCB design means more than just following trends – it requires learning from...

By David Haboud