Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

Semiconductor Packaging

How to Design Smarter: System-level multiphysics in 3D integration

August 07, 2025

What happens when a perfectly functioning chip fails to perform in a 3D IC package? As semiconductor designs stack multiple...

By John McMillan

Electronic Systems Design

Extending design left with PartQuest Design Enablement

August 06, 2025

Engineering begins before ECAD Traditional electronics design divides component research and tool-based design execution into separate stages. Engineers typically research...

Electronic Systems Design

What’s new in Z-planner Enterprise 2504

August 04, 2025

Z-planner Enterprise 2504 release The latest 2504 release of Z-planner Enterprise delivers powerful updates that streamline stackup planning, improve rigid-flex...

By Patrick Hope

Electronic Systems Design

How to have actionable DFM reviews: Unlocking digital manufacturing for SMBs with PCBflow and Xpedition Standard

With the release of Xpedition Standard, Siemens is delivering actionable DFM reviews that empower SMB teams to design with confidence.

By David Haboud

Electronic Systems Design

What’s new in Valor NPI 2504

The latest Valor NPI 2504 release delivers powerful enhancements that make your Design for Manufacturing (DFM) analysis faster, more intelligent,...

By Patrick Hope

Semiconductor Packaging

Ultimate guide to IC package types: choose the right package technology

Integrated circuits (ICs) are the foundation of modern electronics, powering everything from smartphones and medical devices to servers and automotive...

By John McMillan

Calibre IC Design & Manufacturing

How to boost reliability with early-stage reliability checks

By Chun-hsiang Chang The rapid expansion of AI-powered consumer electronics is pushing IC manufacturing to the sub-2 nm frontier. To...

By Calibre IC Design & Manufacturing

Forging the Future of Library Verification with AI-Powered Custom IC Design and Verification Solutions

Discover how the powerful collaboration between Samsung Foundry and Siemens EDA has resulted in a groundbreaking methodology to speed up standard cell library verification by 14X over conventional approaches.

By Neel Natekar

Electronic Systems Design

Unlocking the power of 3D component digital twins for SMB and individuals

Leveraging component digital twins—virtual representations of physical components that provide comprehensive information about their characteristics and behaviors.

By David Haboud