Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

Electronic Systems Design

Closing the gap: How Manufacturing-Driven Design is transforming PCB engineering

Previously on episode 24 of the Printed Circuit Podcast, host Steph Chavez brought together two seasoned experts—Max Clark, Product Strategy...

Electronic Systems Design

Designing smarter, not harder: Embracing PCB design automation in PCB engineering

Previously on the premiere episode of Season 3 of the Printed Circuit Podcast, host Steph Chavez sat down with John...

Cre8Ventures (Siemens EDA)

SpinEdge Joins the Siemens Cre8Ventures Digital Twin Marketplace

We’re thrilled to announce that SpinEdge.ai, a breakthrough Israeli semiconductor startup, has officially joined the Siemens Cre8Ventures Digital Twin Marketplace....

By Carson Bradbury

Electronic Systems Design

Avoid overspending on stackup materials in your PCBs - 8 high speed materials to consider

PCB material discussions are often focused around stackup material selection. These tend to be framed by questions like: ‘We use material ‘x’ for our designs and really like it. What do you think of it?’ This often veils the real question which is: ‘Do you know a good alternative to it?’

By Patrick Hope

Electronic Systems Design

Introducing Xpedition Standard: Scalable PCB design power for growing teams

We are proud to announce the launch of Xpedition Standard, a transformative PCB design solution that delivers the power of the industry-leading Xpedition technology in a scalable, cost-efficient package tailored for growing teams.

By David Haboud

Electronic Systems Design

Introducing: PADS Pro Essentials

We are excited to introduce PADS Pro Essentials, a transformative PCB design offering that brings the power of Xpedition technology within reach of independent engineers and small projects, without the hefty price tag or steep learning curve.

By David Haboud

Semiconductor Packaging

3D IC technology trends: how advanced IC packaging is changing the semiconductor industry

The semiconductor industry is rapidly evolving with 3D IC technology and advanced packaging solutions revolutionizing chip design and manufacturing. In...

By John McMillan

Design with Calibre

Overcoming noise challenges in analog and RF circuit design with Calibre PERC net shielding

By Hossam Sarhan Communication has become the backbone of everything from personal routines to industry, and the demand for analog...

By Design With Calibre

Semiconductor Packaging

3D IC technology: your comprehensive guide to enabling heterogeneous integration

What is 3D IC technology? 3D IC technology refers to the integration of multiple silicon dies or wafers in a...

By John McMillan