IC visualization: Supercharge debug of hidden parasitic threats with Calibre

By Omar Elabd If you’ve ever watched your simulation pass with flying colors, only to see your silicon fail in…

Driving 3D IC innovation with Calibre multiphysics 

Explore how Siemens EDA’s multiphysics workflow helps design teams to overcome the thermal, stress and reliability challenges of 3D ICs. Learn why early, integrated analysis with tools like Calibre 3DSTACK and Innovator3D IC is critical to success in advanced chiplet design.

Infineon and Siemens collaborate for innovation

By Karen Chow When Infineon needed to select a field solver for the development of their next-generation power semiconductor products,…

Outta my way – electrons coming through!

By Joel Mercier and Karen Chow Ever been in a hurry to get to a meeting, but there were a…

Parasitic Extraction for Accurate Signal Integrity Analysis at Advanced Nodes

Parasitic Extraction for Accurate Signal Integrity Analysis at Advanced Nodes

By Karen Chow, Mentor Graphics Signal integrity analysis at advanced nodes requires new and enhanced parasitic extraction techniques

Extraction Challenges Grow in Advanced Nanometer IC Design

Extraction Challenges Grow in Advanced Nanometer IC Design

By Carey Robertson, Mentor Graphics The Calibre xACT platform is a new type of extraction tool that provides a range…