Siemens-imec collaboration reduces stochastic failures in EUV lithography by orders of magnitude in wafer-level experimental validation

Siemens stochastic-aware OPC reduces EUV stochastic failures at wafer level for SRAM and logic, validating predictive modeling with experimental data.

Siemens shines at the 2025 SPIE Advanced Lithography + Patterning symposium

The SPIE Advanced Lithography + Pattering symposiums were held 23-27 February this year with the usual enthusiastic and sizable attendance…

A new method of scaling and efficiency for the semi-manufacturing flow

By Beth Martin Calibre sets sail on Kubernetes While most Calibre semi-manufacturing jobs still run on on-premises compute clusters using…

Curves ahead for IC manufacturing

By John Sturtevant It turns out that the ideal mask pattern to print such a circle is in fact a…

Machine learning-enabled closed loop DFM

SPIE-ing at a distance…

The SPIE Advanced Lithography Digital Forum took place Feb 22-26, and of course, Siemens EDA was there! We wouldn’t miss…

Sign-off lithography simulation and multi-patterning must play well together

Sign-off lithography simulation and multi-patterning must play well together

By Joe Kwan, Mentor Graphics At 20 nm and below, designers must ensure their lithography simulation can incorporate and analyze…

What about MEMS?

What about MEMS?

By Carey Robertson, Mentor Graphics With circuit performance driven by capacitance values, accurate calculations are critical for MEMs designers.