The march toward 3D ICs and advanced packaging brings unrivaled performance and integration opportunities—but it also raises new reliability challenges…
By James Paris As chip designs grow more complex and SoCs reach new heights in size and integration, the challenges…
By John Ferguson The challenge: Traditional DRC can’t keep up… Increasing complexity and automation in IC design have made traditional…
By Matthew Hogan As the industry continues to push the boundaries of what’s possible in IC design, the need for…
By Sara Khalaf Symmetry plays a crucial role in IC design by ensuring balanced device behavior, minimizing mismatch, and improving…
Siemens Digital Industries Software’s Calibre® 3DThermal tool was awarded the 2024 AspenCore World Electronics Achievement Award (WEAA) in the EDA/IP/Software…
By Michael White and David Abercrombie As IC design complexity continues to grow, companies are turning to the shift left…
By Ritu Walia Repetitive layout vs. schematic (LVS) runs can significantly delay project timelines. A huge number of shorted nets…
By Lee Wang The semiconductor industry is undergoing a transformative shift from traditional 2D integrated circuit (IC) designs to more…
