Fast, efficient, productive? Your early-stage IC design physical verification can be all that…

By John Ferguson and Nermeen Hossam With each new process node comes more complex requirements needed to ensure working silicon. …

Infineon and Siemens collaborate for innovation

By Karen Chow When Infineon needed to select a field solver for the development of their next-generation power semiconductor products,…

mPower power integrity analysis solution recognized for innovation and market impact

By Joe Davis Sponsored by France’s ElectroniqueS magazine, the Electrons d’Or Award program identifies the most innovative products of the…

Struggling to verify the reliability of your multiple-power-domain designs?

By Hossam Sarhan With the growing complexity of system-on-chip designs and technology scaling, multiple power domains are needed to optimize…

Google, AMD, and Siemens EDA walk into a cloud…

By Michael White At DAC this past July, I had the opportunity to sit down with Phil Steinke from AMD…

What’s an ESD design window, and why do I care?

By Derong Yan As we move to advanced semiconductor process nodes, electrostatic discharge (ESD) issues have become more critical in…

Can you spot the difference?

By James Paris We’ve all played those “Spot the Difference” games where you look at two similar images and try…

Outta my way – electrons coming through!

By Joel Mercier and Karen Chow Ever been in a hurry to get to a meeting, but there were a…

Papers and posters and prizes…oh my! Siemens EDA at DAC59!

By Shelly Stalnaker The Design Automation Conference of 2022 has come to an end. As the dust settles, and the…