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Navigating 3D IC stress: physical realities and best practices for 3D IC reliability

By Shetha Nolke As the semiconductor industry shifts toward heterogeneous 3D ICs, exciting benefits are coming within reach—from smaller footprints…

Ensure power domain compatibility by finding missing level shifters with Insight Analyzer

By Bhanu Pandey Level shifters are essential for safe, reliable mixed-signal IC design—especially as designers deploy more power domains than…

Stress less, innovate more: ensuring 3D IC reliability with Siemens Calibre 3DStress

The march toward 3D ICs and advanced packaging brings unrivaled performance and integration opportunities—but it also raises new reliability challenges…

Calibre Vision AI: a new era of fast, scalable chip-level DRC debug

By James Paris As chip designs grow more complex and SoCs reach new heights in size and integration, the challenges…

Enhancing EUV lithography resolution at high numerical aperture

By Ethan Maguire As the semiconductor industry continues to push the boundaries of feature size and density, the need for…

Overcoming noise challenges in analog and RF circuit design with Calibre PERC net shielding

By Hossam Sarhan Communication has become the backbone of everything from personal routines to industry, and the demand for analog…

Calibre xACT takes a hybrid approach to parasitic extraction

By Mark Tawfik Parasitic extraction plays a pivotal role in the design and optimization of integrated circuits (ICs). Extraction involves…

Smart strategies for metal fill extraction

By Shehab Ashraf As semiconductor technology continues to scale, the impact of parasitic effects from metal fill structures has become…

Solving inter-domain leakage challenges: Enhancing IC design with Insight Analyzer

By Charlie Olson Design reliability remains a top priority for engineers in the world of semiconductor technology. One critical challenge…