PCI Express 8.0: Powering AI, Cloud, and HPC with Transformative Interconnect Technology

PCIE Gen 8 is available now!

PCIe Express 8.0 is a fundamental leap forward in interconnect technology. By doubling data rates to an unprecedented 256 GT/s per lane, PCIe Gen8 promises to unlock new possibilities across industries, from enabling more sophisticated AI training workflows to supporting the complex AI models and multi-sensor ecosystems that will define next-generation vehicles.

DVCon US 2026 Keynote Verification Convergence

DVCon US Keynote: Why Verification Must Evolve in the Convergence Era

At DVCon US 2026, a keynote delivered by three speakers—Abhi Kolpekwar (Siemens EDA), Jean-Marie Brunet (Siemens EDA), and Alon Shtepel…

DVCon U.S. 2026 to be held at March 2-5, 2026

Siemens at DVCon U.S. 2026

DVCon U.S. returns to a larger venue at the Hyatt Regency Santa Clara. The expanded rooms and exhibit hall are intended to support a program heavily focused on AI in verification.

FutureCast 2026

FutureCast 2026: A Special Holiday Edition of BUGGED OUT

As another year closes, the semiconductor industry finds itself in a moment of transition—one where the pace of innovation is…

BUGGED OUT PODCAST

Introducing BUGGED OUT — A new bite-sized podcast for verification engineers

BUGGED OUT Podcast

New RTL Modeling Constructs in Verilog

I’ve been packing up my office as Siemens is closing my location. This marks the longest I’ve ever spent in a single office, a whopping 15 years. Coincidentally, I was in the same building earlier with another company, Avant! for an additional 2 years. I’ve got a box of stuff from previous jobs that I rarely unpack. But it happened to go through it and found the proceedings from what was to become the first DVCon in 1992. I doubt these proceedings exist anywhere in digital form.

In the proceedings was a paper I published about a new RTL modeling construct I added to Verilog before it became an IEEE standard. It eventually became known as a NonBlocking Assignment (NBA).

Pushing boundaries: Smarter verification for UCIe multi-die systems

The semiconductor industry is at a turning point. As demand for higher performance and energy efficiency continues to grow, chipmakers…

From Novice to Expert: Your Tutorial Roadmap at DVCon Europe 2025

In support of Verification Academy’s educational mission, Siemens is either directly sponsoring or contributing to the following five tutorials at…

Class is back in session this October: Verification Academy’s cutting-edge weekly webinar series

Verification Academy’s fall semester starts this October with the following series of weekly deep dive webinars. Abstracts and registration links…