Watch this on-demand webinar to learn about how the new Tessent Multi-die software automates the complex DFT tasks associated with 2.5D and 3D IC designs.
“Great things happen when the world agrees,” is the smart tag line of the ISO standards organization. Indeed, the ISO…
Register now for the hybrid live/online Asian Test Symposium 2022, an IEEE-sponsored international forum of engineers and researchers sharing the…
Hierarchical designs that are tile-based or abutment based physical blocks are predominant in today’s chips. Having no logic present at the chip-level calls for new approaches to testing these tile-based architectures. How a design for test (DFT) architecture can support tile-based designs is the focus of this presentation from U2U 2022.
Join Tessent at the 48th International Symposium for Testing and Failure Analysis, the premier event for the microelectronics failure analysis community.
Yes, there is a path to a scalable, affordable, and comprehensive DFT solution for 3D ICs.
Siemens’ Tessent Embedded Analytics IP and software, Host Services software opens the lines of communication with your chip and brings SLS one step closer to reality.
The Tessent group participated in the “unique event fully dedicated to IP and IP-based electronic systems,” D&R IP-SoC Silicon Valley…
The explosive growth in the use of memory content on SoCs calls for a new solution to effectively access the…
