Hierarchical designs that are tile-based or abutment based physical blocks are predominant in today’s chips. Having no logic present at the chip-level calls for new approaches to testing these tile-based architectures. How a design for test (DFT) architecture can support tile-based designs is the focus of this presentation from U2U 2022.
Join Tessent at the 48th International Symposium for Testing and Failure Analysis, the premier event for the microelectronics failure analysis community.
Yes, there is a path to a scalable, affordable, and comprehensive DFT solution for 3D ICs.
Siemens’ Tessent Embedded Analytics IP and software, Host Services software opens the lines of communication with your chip and brings SLS one step closer to reality.
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