Manage the effects of chip complexity with Embedded Analytics

By Richard Oxland – Siemens Digital Industries Software If you’ve never heard of Embedded Analytics,…

VTS 2020 best paper_Tessent

Tessent wins Best Paper award at IEEE VLSI Test Symposium

The best paper of the 2020 symposium describes a layout-friendly EDT decompressor that reduces routing…

Secure and Up-to-date: Monitor and Control Automotive devices with Over-the-Air Updates

By Lee Harrison – Automotive Test Solutions Manager, Siemens EDA The topic of safety and…

Improve defect detection for competitive, high-quality SoCs

To deliver the highest quality SoCs, these manufacturing test strategies ensure defects are detected before…

Introducing Tessent Streaming Scan Network

Slash test costs and reduce implementation effort for complex next-generation SoCs. IC engineering teams have…

Tessent’s ITC 2020 wrap-up

The International Test Conference carried on this year as a virtual event. It’s a difficult…

DFT and the competitive edge

Advanced DFT is your competitive edge Every new SoC project starts with grand hopes of…

Tessent Wraps Up Summer Webinar Series

The summer of 2020 featured several new webinars from the Tessent Test Solutions group at…

Video: ITC India 2020 keynote—Test community can take on silicon lifecycle challenges

The role of test is expanding from its traditional role into one that includes managing…