Tessent at 2021 ITC-Asia

The 2021 IEEE International Test Conference is a virtual event this year, streaming live to the world from Wednesday, August…

Webinar – Optimize manycore AI and ML designs

Turn complexity into a competitive advantage by harnessing system-level data to optimize manycore AI and ML chips. Our new on-demand…

Tessent SystemInsight: simultaneous analysis of hardware and software in complex SoC designs

Newly renamed and upgraded, the Tessent™ SystemInsight integrated development environment (IDE) now supports cycle-accurate processor trace and a range of…

Manage automotive test, safety, and security with a safety island

The makers of automotive ICs are living in “interesting times.” These ICs no longer only run simple functions such as window…

Join Tessent at the VOICE Developer Conference

Tessent invites you to join us at the upcoming VOICE Developer Conference happening virtually from June 21-23, 2021. VOICE is…

RealizeLIVE + User2User

Don’t miss these Tessent sessions at Realize LIVE + User2User event – May 26, 2021

Explore the latest DFT, operations and embedded analytics technologies at Realize LIVE + U2U 2021. The May 26, 2021 user…

Manage the effects of chip complexity with Embedded Analytics

By Richard Oxland – Siemens Digital Industries Software If you’ve never heard of Embedded Analytics, it’s time to learn how…

VTS 2020 best paper_Tessent

Tessent wins Best Paper award at IEEE VLSI Test Symposium

The best paper of the 2020 symposium describes a layout-friendly EDT decompressor that reduces routing congestion associated with decompressor circuitry…

Secure and Up-to-date: Monitor and Control Automotive devices with Over-the-Air Updates

By Lee Harrison – Automotive Test Solutions Manager, Siemens EDA The topic of safety and security for automotive ICs and…