Learn how Intel adopted Tessent SSN packet-based ATPG and reduced test time by 34% in this video recorded at the 2023 North America U2U symposium.
Learn how Broadcom used Tessent Multi-die to build a 3D IC flow in this video recorded at the 2023 North America U2U symposium.
Learn how NXP achieves zero defects for bridging defects with Tessent’s defect oriented test in this video recorded at the 2023 North America U2U symposuim.
Break through yield barriers with Siemens and PDF Solutions. Watch this video recorded at the 2023 North America U2U symposuim.
There’s lots of action right now in refreshing popular test standards and developing new ones. Read this update on the friends and family of IEEE 1149.1 JTAG and IEEE 1687 IJTAG.
Learn about using a safety island for effective control and monitoring of automotive ICs.
Learn about generating clocks in Tessent Streaming Scan Network (SSN) in this presentation and Q&A recorded at the 2023 U2U North America.
A novel approach from Siemens and PDF Solutions shows promise in speeding yield ramp on advanced nodes and solving yield…
Connected vehicles are vulnerable to cyberattack. Designing-in security features future-proofs vehicles against hackers.
