2.5D and 3D IC design testing challenges

Shifting left for earlier testing in 2.5D and3D IC design

In our last 3D IC blog, we talked about the impact of 3D IC on device reliability. In today’s blog,…

Image of a semiconductor package design

What are the top challenges of high-performance computing/AI semiconductor package design?

If you’re designing a high-performance processor-based package,  it’s common for the semiconductor package design to contain multiple logic chips that…

Revolutionizing semiconductors with 3D IC and chiplet technology

Each Industrial Revolution resulted in advancements that propelled humans forward into a seemingly different world. The first in 1784 was…

Illustration that says next generation IC Packaging part 4

The five keys to next-generation IC packaging design: Part 4

“Golden signoff” – The final step in the semiconductor packaging process In my last blog post, I talked about the…

3D heterogeneous integration devices with multiple 3D IC components

The impact of 3d heterogeneous integration on semiconductor device reliability

So far in our 3D IC blog series, we’ve discussed front-end design approaches to develop 3D IC-based devices, the importance…

The five keys to next-generation IC packaging design: Part 3

Scalability and range of IC packaging design solutions In my last blog, I talked about multi-domain and cross-domain integration that…

Engineer seated at computer studying physical prototype for early planning of interconnect systems and design verification workflows

Importance of early planning for interconnect verification in 3D IC physical design workflows

In our last podcast on 3D IC architecture workflows, we discussed how a system or microarchitectures determine how to partition…

The five keys to next-generation IC packaging design: Part 2

Multi-domain integration enables faster time to market for complex advanced semiconductor packages with a seamless integration of design and verification.

3D IC design engineer using gloved hands to inspect and verify components

Front-end architectural verification considerations for 3D IC design

So far in our 3D IC blog series, we’ve discussed efforts to create chiplet ecosystems, design workflow changes needed to…