​Why Traditional PCB Methods Fall Short in 3D IC Design

In this episode of the Siemens 3D IC Podcast Series,we delve into the world of FOWLP (Fan-out wafer-level packaging) with…

​3D IC technology trends: Microarchitecture in IC design

In this latest Siemens EDA 3D IC podcast episode, we explore microarchitecture’s crucial role in 3D IC design. Listen in…

​3D IC technology trends: how advanced IC packaging is changing the semiconductor industry

The semiconductor industry is rapidly evolving with 3D IC technology and advanced packaging solutions revolutionizing chip design and manufacturing. In…

Heterogeneous integration eBook IC Packaging

How can IC and package designers navigate the complexities of heterogeneous integration?

Heterogeneous integration has transformed the design of complex devices, enabling engineers to swiftly and affordably create advanced system-in-packages by combining…

3D IC design solutions: 2024 – Year in review

Welcome to a look back at a landmark year in 3D IC technology — 2024 was nothing short of revolutionary!…

EE Times Fireside chat: Linking design to manufacturing for a sustainable semiconductor future

Listen in as Michael Munsey, VP at Siemens EDA, joins EE Times’ Sally Ward-Foxton for a Fireside chat Q&A session…

Taking 3DIC heterogeneous integration mainstream

In this presentation, we will explore the challenges introduced by 3DIC, the current state of the industry to address those challenges, the ecosystem needed to support 3DIC, and how users today can successfully adopt 3DIC leveraging new solutions, workflows, and 3DIC Design Kits (3DK) from Siemens EDA that are designed specifically with 3DIC in mind.

User2User 2024: Meeting future performance demands through packaging: ChipletZ

Learn how 3DIC tech enhances compact, high-performance systems but faces verification challenges. We explore solutions and methodologies, including the use of Siemens XSI and Calibre 3DSTACK.

Enabling comprehensive DFT for chiplets and 3DICs using Tessent Multi-die

Learn about Siemens’ Tessent Multi-die solution for 3DIC packaging.