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Discover how AI is changing the nature of semiconductor design

July 16, 2024

AI is shaping the semiconductor industry’s future and its alignment with Siemens’ commitment to innovation and enhancing sustainability by accelerating…

By John McMillan
2 MIN READ

A deep dive into HDAP LVS/LVL verification

January 29, 2024

EDA companies are developing tools and workflows to support HDAP (High-density advanced packaging) LVS/LVL verification. Though the data for achieving “signoff-level” confidence is a work in progress, EDA companies are providing tools that can adapt to different levels of data availability and enable HDAP designers to execute HDAP LVS/LVL flows that are both productive and beneficial.

By John McMillan
4 MIN READ
Siemens 3D IC heterogeneous semiconductor packaging workflows catapult design teams into the future of IC design today.

Workflows for tackling heterogeneous integration of chiplets for 2.5D/3D semiconductor packaging

January 11, 2024

Workflows for tackling heterogeneous integration of chiplets for 2.5D/3D semiconductor packaging.

By John McMillan
4 MIN READ

Parasitic extraction technologies: Advanced node and 3D-IC design

January 2, 2024

Advanced nodes and 3D-IC packages require new and enhanced parasitic extraction processes that can resolve a variety of complex parasitic issues in these designs.

By John McMillan
3 MIN READ

Impacts of 3D IC on the future

December 20, 2023

3D IC technology development started many years ago well before the slowing down of Moore’s law benefits became a topic…

By John McMillan
3 MIN READ

Revolutionizing semiconductors with 3D IC and chiplet technology

February 9, 2023

Each Industrial Revolution resulted in advancements that propelled humans forward into a seemingly different world. The first in 1784 was…

By Trisha Garrett and Heather George
5 MIN READ
3D heterogeneous integration devices with multiple 3D IC components

The impact of 3d heterogeneous integration on semiconductor device reliability

December 8, 2022

So far in our 3D IC blog series, we’ve discussed front-end design approaches to develop 3D IC-based devices, the importance…

By Heather George
21 MIN READ
Test engineer performing design rule checks manually for 3D IC heterogenous designs

Assembly level layout vs. schematic in 3D IC design verification

November 8, 2022

In our fifth podcast on 3D IC design workflows, we discussed what a 3D IC physical design workflow looks like,…

By Heather George
16 MIN READ
Engineer seated at computer studying physical prototype for early planning of interconnect systems and design verification workflows

Importance of early planning for interconnect verification in 3D IC physical design workflows

October 24, 2022

In our last podcast on 3D IC architecture workflows, we discussed how a system or microarchitectures determine how to partition…

By Heather George
16 MIN READ