3D heterogeneous integration devices with multiple 3D IC components

The impact of 3d heterogeneous integration on semiconductor device reliability

So far in our 3D IC blog series, we’ve discussed front-end design approaches to develop 3D IC-based devices, the importance…

Test engineer performing design rule checks manually for 3D IC heterogenous designs

Assembly level layout vs. schematic in 3D IC design verification

In our fifth podcast on 3D IC design workflows, we discussed what a 3D IC physical design workflow looks like,…

Engineer seated at computer studying physical prototype for early planning of interconnect systems and design verification workflows

Importance of early planning for interconnect verification in 3D IC physical design workflows

In our last podcast on 3D IC architecture workflows, we discussed how a system or microarchitectures determine how to partition…

Evolution of 3D IC Architecture and the impact to design flows

Evolution of 3D IC Architecture and the impact to design flows

In our last blog about 3D IC, we discussed the models chiplet vendors need to provide System-in-Package (SiP) integrators to…

3D IC and the system-technology co-optimization (STCO) approach

3D IC and the system-technology co-optimization (STCO) approach

Semiconductor engineers aim to deliver best-in-class devices despite technology scaling and cost limitations of monolithic integrated circuit (IC) design. To…

What’s the current state of 3D IC design?

In the first podcast about 3D IC heterogeneous integration, we talked about the disaggregation of once monolithic implementation architectures into…

The beginner’s guide to 3D IC

The beginner’s guide to 3D IC

As consumer electronic devices grow increasingly connected, intelligent and advanced, designers need new methodologies such as 3D IC to address…