Product: Xpedition IC Packaging

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Siemens Innovator 3D IC wins 3D InCites award for 2025

Siemens Innovator3D IC wins 2025 3D InCites Technology Enablement award

April 2, 2025

In the fast-evolving landscape of semiconductor technology, innovation and collaboration are key drivers of progress. As advanced interconnect and packaging…

By Tova Levy
2 MIN READ
Heterogeneous integration eBook IC Packaging

How can IC and package designers navigate the complexities of heterogeneous integration?

March 19, 2025

Heterogeneous integration has transformed the design of complex devices, enabling engineers to swiftly and affordably create advanced system-in-packages by combining…

By Tova Levy
2 MIN READ

Accelerate IC design innovation with Siemens: Navigating the future of 3D IC design to manufacturing

March 7, 2025

In the rapidly evolving semiconductor industry, the drive towards miniaturization and the integration of complex functions through advanced packaging and…

By John McMillan
3 MIN READ

3D IC design solutions: 2024 – Year in review

December 16, 2024

Welcome to a look back at a landmark year in 3D IC technology — 2024 was nothing short of revolutionary!…

By John McMillan
3 MIN READ

User2User 2024: Pioneering semiconductor reliability automotive apps – imec’s Canary chip

November 5, 2024

In this User2User 2024 presentation, Dr. Thomas Kallstenius, representing imec, the world’s leading independent research institute specializing in nanoelectronics, whose Belgium-based…

By John McMillan
4 MIN READ

EE Times Fireside chat: Linking design to manufacturing for a sustainable semiconductor future

October 21, 2024

Listen in as Michael Munsey, VP at Siemens EDA, joins EE Times’ Sally Ward-Foxton for a Fireside chat Q&A session…

By John McMillan
2 MIN READ

Taking 3DIC heterogeneous integration mainstream

October 2, 2024

In this presentation, we will explore the challenges introduced by 3DIC, the current state of the industry to address those challenges, the ecosystem needed to support 3DIC, and how users today can successfully adopt 3DIC leveraging new solutions, workflows, and 3DIC Design Kits (3DK) from Siemens EDA that are designed specifically with 3DIC in mind.

By John McMillan
3 MIN READ

User2User 2024: Meeting future performance demands through packaging: ChipletZ

September 27, 2024

Learn how 3DIC tech enhances compact, high-performance systems but faces verification challenges. We explore solutions and methodologies, including the use of Siemens XSI and Calibre 3DSTACK.

By John McMillan
4 MIN READ

Enabling comprehensive DFT for chiplets and 3DICs using Tessent Multi-die

September 24, 2024

Learn about Siemens’ Tessent Multi-die solution for 3DIC packaging.

By John McMillan
4 MIN READ