3D IC design solutions: 2024 – Year in review

Welcome to a look back at a landmark year in 3D IC technology — 2024 was nothing short of revolutionary!…

User2User 2024: Pioneering semiconductor reliability automotive apps – imec’s Canary chip

In this User2User 2024 presentation, Dr. Thomas Kallstenius, representing imec, the world’s leading independent research institute specializing in nanoelectronics, whose Belgium-based…

EE Times Fireside chat: Linking design to manufacturing for a sustainable semiconductor future

Listen in as Michael Munsey, VP at Siemens EDA, joins EE Times’ Sally Ward-Foxton for a Fireside chat Q&A session…

Taking 3DIC heterogeneous integration mainstream

In this presentation, we will explore the challenges introduced by 3DIC, the current state of the industry to address those challenges, the ecosystem needed to support 3DIC, and how users today can successfully adopt 3DIC leveraging new solutions, workflows, and 3DIC Design Kits (3DK) from Siemens EDA that are designed specifically with 3DIC in mind.

User2User 2024: Meeting future performance demands through packaging: ChipletZ

Learn how 3DIC tech enhances compact, high-performance systems but faces verification challenges. We explore solutions and methodologies, including the use of Siemens XSI and Calibre 3DSTACK.

Enabling comprehensive DFT for chiplets and 3DICs using Tessent Multi-die

Learn about Siemens’ Tessent Multi-die solution for 3DIC packaging.

Text that says what's new in IC Packaging 2409 next to a stylized X

What’s new in IC Packaging 2409

The 2409 release is a landmark update in the field of electronic design automation (EDA), introducing a next-generation solution for…

Image of a 3D IC with text that says TSMC 2024 NA OIP Ecosystem Forum

Join us at the TSMC 2024 NA OIP Ecosystem Forum

The TSMC 2024 North America OIP (Open Innovation Platform®) Ecosystem Forum is just around the corner, and Siemens EDA is…

User2User 2024: Silicon photonics to integrate chiplets: Swissbit

Swissbit is pioneering chiplet and system-on-package solutions that embed security and functional safety from the design phase to meet stringent requirements in harsh industrial and automotive environments.