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Taking 2.5D/3D IC physical verification to the next level

Taking 2.5D/3D IC physical verification to the next level

February 21, 2024

Taking 2.5D/3D IC physical verification to the next level. As package designs continue to evolve, so must the verification requirements. Designers working on even the most complex multi-die, multi-chiplet stacked configurations require enhanced checking capabilities to quickly and easily verify that the physical die are placed correctly to ensure proper connectivity and electrical behavior.

By John McMillan
4 MIN READ

A deep dive into HDAP LVS/LVL verification

January 29, 2024

EDA companies are developing tools and workflows to support HDAP (High-density advanced packaging) LVS/LVL verification. Though the data for achieving “signoff-level” confidence is a work in progress, EDA companies are providing tools that can adapt to different levels of data availability and enable HDAP designers to execute HDAP LVS/LVL flows that are both productive and beneficial.

By John McMillan
4 MIN READ
Siemens 3D IC heterogeneous semiconductor packaging workflows catapult design teams into the future of IC design today.

Workflows for tackling heterogeneous integration of chiplets for 2.5D/3D semiconductor packaging

January 11, 2024

Workflows for tackling heterogeneous integration of chiplets for 2.5D/3D semiconductor packaging.

By John McMillan
4 MIN READ

Parasitic extraction technologies: Advanced node and 3D-IC design

January 2, 2024

Advanced nodes and 3D-IC packages require new and enhanced parasitic extraction processes that can resolve a variety of complex parasitic issues in these designs.

By John McMillan
3 MIN READ
3D heterogeneous integration devices with multiple 3D IC components

The impact of 3d heterogeneous integration on semiconductor device reliability

December 8, 2022

So far in our 3D IC blog series, we’ve discussed front-end design approaches to develop 3D IC-based devices, the importance…

By Heather George
21 MIN READ
Test engineer performing design rule checks manually for 3D IC heterogenous designs

Assembly level layout vs. schematic in 3D IC design verification

November 8, 2022

In our fifth podcast on 3D IC design workflows, we discussed what a 3D IC physical design workflow looks like,…

By Heather George
16 MIN READ

3D IC verification requires a golden netlist that allows exceptions

August 29, 2022

With current 3D IC packaging technologies, since the system-level netlist (the 3D IC design intent) drives system-level LVS verification, designers…

By Tarek Ramadan
< 1 MIN READ
3D IC and the system-technology co-optimization (STCO) approach

3D IC and the system-technology co-optimization (STCO) approach

August 3, 2022

Semiconductor engineers aim to deliver best-in-class devices despite technology scaling and cost limitations of monolithic integrated circuit (IC) design. To…

By anthonymastroianni
2 MIN READ

What’s the current state of 3D IC design?

July 20, 2022

In the first podcast about 3D IC heterogeneous integration, we talked about the disaggregation of once monolithic implementation architectures into…

By Heather George
9 MIN READ