3D of a PCB

PCB high voltage spacing: What every engineer should know

At the heart of high-voltage PCB reliability is proper PCB high voltage spacing between conductive elements.

Siemens Xcelerator X with PCB 3D inside

What’s new in Xpedition Enterprise 2504

Building on the core 2409 release, where we introduced the concept of the next generation of electronic systems design, the Xpedition Enterprise 2504 release continues to enhance and expand this vision.

Aerial view of agricultural silos.

Beyond silos: Enabling multidomain and multidiscipline integration in electronic systems design

Engineering success depends not just on deep expertise, but on seamless integration across domains and disciplines.

Image of CAM350 software on a computer screen.

Siemens welcomes DownStream Technologies

Siemens Digital Industries Software has acquired DownStream Technologies.

An image of a stylized printed circuit board

Unlock the future of electronic systems design at Realize LIVE Americas and Europe

In a rapidly evolving software-driven world, electronics content is becoming increasingly prevalent in all aspects of products and services. At…

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Design for manufacturing output files – optimizing engineering to manufacturing efficiency

As PCB design and manufacturing become increasingly complex, the choice of design for manufacturing output files plays a crucial role in streamlining processes, reducing errors, and improving time to market.

blind and buried vias

Blind and buried vias: An HDI technology

One of the key innovations within HDI PCB design is the use of blind and buried vias, which enhance routing capabilities by freeing up additional routing resources, increasing the amount of routing channels while requiring fewer signal layers, and optimizing board space.

Optimizing FPGA/PCB co-design: Best practices and industry insights

Previously on episode 20 of the Printed Circuit Podcast, host Steph Chavez explored the intricacies of FPGA (field-programmable gate array)…

An image of a PCB with the headshots of Alexander Pohl, Andre Alcalde, and Tobias Pohl.

Innovators unplugged: an interview with the three CELUS co-founders

The co-founders of CELUS were able to join us on the show floor at Electronica, so we asked them to sit down with us and shed some light on their mission, vision, and overall excitement about collaborating with Siemens.