Tips & Tricks

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Young Designer Working on a Desktop Computer in Creative Office on Teamcenter X Software.

PLM integration: Stop connecting systems. Start connecting engineering.

October 12, 2026

PLM integration is not an IT problem. It is an engineering feedback-loop problem. Most organizations already have the systems they need to manage product data.

By Stephen V. Chavez
5 MIN READ
Abstract image of AA batteries with text that says Tutorial #1: PartQuest Main Parts

AA battery replacement project tutorial #1:  PartQuest main parts

October 9, 2026

Read Shrouk’s first tutorial for her AA battery replacement project and follow along with Xpedition Standard.

By Shrouk El-Attar
4 MIN READ
A PVB manufacturing line.

Digital PCB manufacturing handoff for seamless production

September 24, 2026

For years, we have referred to the transition from PCB design into manufacturing as a PCB manufacturing “handoff.” Engineering completes…

By Stephen V. Chavez
4 MIN READ
an image of a BOM from connect software

Proactive BOM analysis for supply chain resilience

August 20, 2026

BOM risk has become a critical design constraint, where a single part shortage can trigger weeks of redesign churn and…

By David Haboud
4 MIN READ
Image of a Bill of Materials from Xpedition Connect.

The BOM Is no longer documentation, it’s engineering intelligence

August 6, 2026

The Bill of Materials deserves to be viewed differently. It is no longer simply documentation created after engineering decisions have been made. It is one of the earliest indicators of product resilience and one of the richest sources of engineering intelligence available to the development team.

By Stephen V. Chavez
4 MIN READ
An image of a loaf of bread representing PCB simulation.

How to choose the best chainsaw to cut a loaf of bread?

August 5, 2026

Here is the truth that you need to hear: In PCB simulation, overkill is the ultimate bottleneck. You think that running a 3D solver on your board should close the inaccuracy gap, while, in reality, it opens a productivity gap.

By Sajeda Tamimi
3 MIN READ
Screen shot of software showing Modeling an SET in HyperLynx AMS

Single Event Effects (SEE) in Rad-Hard components with HyperLynx AMS

July 30, 2026

What makes SEEs particularly challenging is that they can’t be stopped by traditional physical shielding, making Radiation-Hardened (Rad-Hard) components essential for systems operating in harsh environments like space or military applications.

By Sajeda Tamimi
3 MIN READ
Two engineers working on PCB designs using Siemens software

Engineering concurrency: The future of collaborative PCB design

July 30, 2026

For decades, electronic product development followed a familiar sequence. System architects defined requirements, electrical engineers developed schematics, PCB designers created…

By Stephen V. Chavez
3 MIN READ
A screen shot of design reuse in Xpedition standard

Design today, reuse tomorrow: mastering IP management for electronics teams

June 25, 2026

Learn how electronics teams can improve reuse, reduce respins, and optimize digital prototypes with better IP management, DFM integration, and connected PCB workflows.

By David Haboud
6 MIN READ