Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

Design with Calibre

Stress less, innovate more: ensuring 3D IC reliability with Siemens Calibre 3DStress

The march toward 3D ICs and advanced packaging brings unrivaled performance and integration opportunities—but it also raises new reliability challenges...

By Design With Calibre

Electronic Systems Design

Navigating easy onboarding in EDA: What engineers need to know

Electronic Design Automation (EDA) sits at the heart of every electronics innovation. Yet for many engineers, onboarding onto an advanced...

By David Haboud

Design with Calibre

Calibre Vision AI: a new era of fast, scalable chip-level DRC debug

By James Paris As chip designs grow more complex and SoCs reach new heights in size and integration, the challenges...

By Design With Calibre

Semiconductor Packaging

2.5D vs. 3D IC: which chip packaging technology is right for you?

Why 2.5D vs. 3D IC matters in modern chip design As semiconductor innovation pushes the limits of Moore’s Law, traditional...

By John McMillan

Electronic Systems Design

Five reasons why small businesses should consider token-based licensing for electronic system design tools

he Xpedition product family has introduced token-based add-on licensing; a tailored approach designed to maximize efficiency and savings, catering specifically to the dynamic needs of small businesses.

By David Haboud

Electronic Systems Design

Remote collaboration in electronic systems design: How teams are building the future… from anywhere

Remote collaboration in ESD is no longer a stopgap nor isn’t just feasible. It’s a strategic shift. It’s a smarter, scalable way to build the future.

By Stephen V. Chavez

Semiconductor Packaging

Why Traditional PCB Methods Fall Short in 3D IC Design

In this episode of the Siemens 3D IC Podcast Series,we delve into the world of FOWLP (Fan-out wafer-level packaging) with...

By John McMillan

Meet the Solido Custom IC Team at DAC 2025

The Solido Custom IC (CIC) team is gearing up for an exciting presence at DAC 2025, where visitors will discover our innovative AI solutions that are transforming the custom IC landscape.

By Emma-Jane Crozier

Electronic Systems Design

Cutting through the noise: Modern strategies for RF PCB design

In season three of the Printed Circuit Podcast, host Steph Chavez sat down with Per Viklund, Director of IC Packaging...