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Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

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Electronic Systems Design

Your #1 defense against a crosstalk crisis

July 10, 2025
It’s been some time since I’ve seen an article on crosstalk, so I decided to take the opportunity to walk...
By Bill Hargin
8 MIN READ

Design with Calibre

Ensure power domain compatibility by finding missing level shifters with Insight Analyzer

July 09, 2025
By Bhanu Pandey Level shifters are essential for safe, reliable mixed-signal IC design—especially as designers deploy more power domains than...
By Design With Calibre
4 MIN READ

Semiconductor Packaging

​The hidden heat challenge of 3D ICs:  And what designers need to know

July 08, 2025
Why is thermal analysis no longer an afterthought in 3D IC design—and what is Siemens doing to empower engineers across...
By John McMillan
12 MIN READ

Electronic Systems Design

Understanding the impact of hatched ground planes on PCB impedance

July 07, 2025
Hatched ground planes can be employed and present an interesting alternative with specific implications for impedance control.
By Stephen V. Chavez
4 MIN READ

Design with Calibre

Stress less, innovate more: ensuring 3D IC reliability with Siemens Calibre 3DStress

July 02, 2025
The march toward 3D ICs and advanced packaging brings unrivaled performance and integration opportunities—but it also raises new reliability challenges...
By Design With Calibre
4 MIN READ

Electronic Systems Design

Navigating easy onboarding in EDA: What engineers need to know

June 30, 2025
Electronic Design Automation (EDA) sits at the heart of every electronics innovation. Yet for many engineers, onboarding onto an advanced...
By David Haboud
3 MIN READ

Design with Calibre

Calibre Vision AI: a new era of fast, scalable chip-level DRC debug

June 25, 2025
By James Paris As chip designs grow more complex and SoCs reach new heights in size and integration, the challenges...
By Design With Calibre
4 MIN READ

Semiconductor Packaging

2.5D vs. 3D IC: which chip packaging technology is right for you?

June 24, 2025
Why 2.5D vs. 3D IC matters in modern chip design As semiconductor innovation pushes the limits of Moore’s Law, traditional...
By John McMillan
6 MIN READ

Electronic Systems Design

Five reasons why small businesses should consider token-based licensing for electronic system design tools

June 20, 2025
he Xpedition product family has introduced token-based add-on licensing; a tailored approach designed to maximize efficiency and savings, catering specifically to the dynamic needs of small businesses. 
By David Haboud
3 MIN READ

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