Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

Tessent Solutions

Tessent earns TSMC OIP Partner of the Year for 3DFabric collaboration

December 01, 2021

Recognition of Tessent’s excellence in next-generation system-on-chip and 3DIC design enablement. Siemens EDA takes industry partnerships seriously, and sometimes we...

By Tessent Solutions

Calibre IC Design & Manufacturing

TSMC OIP Forum celebrates collaboration and innovation…and we have the awards to prove it!

November 29, 2021

TSMC’s Open Innovation Platform® (OIP) brings together the creative thinking of customers and partners with the common goal of shortening...

By Calibre IC Design & Manufacturing

Electronic Systems Design

Flex & rigid-flex PCB DFM: Learn from the expert

November 24, 2021

Flex and rigid-flex circuits use unique materials in the manufacturing process and must be handled differently than FR4 PCBs.

By Patrick McGoff

Electronic Systems Design

Easy and fast DFM analysis now available for PCB designers

November 22, 2021

PCB designers face a lot of challenges. On one hand, the design must fulfill the electrical functionality requirements. On the...

By Shirley Segev

Electronic Systems Design

Creating Custom Automation in Valor NPI Using Scripting Languages

November 10, 2021

The most modern language supported and delivered with Valor NPI is Python. If Perl is your language of choice then an additional module needs to be acquired through Active State. When all else fails there is the legacy C-Shell that is also included with Valor NPI.

Calibre IC Design & Manufacturing

Samsung Foundry and Siemens EDA: Helping companies design the next generation of Performance Platforms 2.0

November 09, 2021

Since 2018, the Samsung Advanced Foundry Ecosystem (SAFE™) program has encouraged and supported deep collaboration between Samsung Foundry and its...

By Calibre IC Design & Manufacturing

Calibre IC Design & Manufacturing

Want to know what went on at the TSMC OIP Forum this year? Here’s the inside scoop…

November 03, 2021

TSMC customers and partners always look forward to the annual TSMC Open Innovation Platform® (OIP) Forums. Here, they get the...

By Calibre IC Design & Manufacturing

Calibre IC Design & Manufacturing

Fix first, finish faster!

October 28, 2021

By James Paris A few years ago, I came across some plans to build a simple bookshelf that would fit...

By Calibre IC Design & Manufacturing

Tessent Solutions

ISTFA 2021

October 28, 2021

Don’t miss the 47th International Symposium for Testing and Failure Analysis (ISTFA 2021) in Phoenix, Arizona from October 31 to...

By Tessent Solutions