Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

Electronic Systems Design

Copper thickness: Closing the knowledge gap to design success

August 13, 2025

Copper thickness determination of rolled and electro-deposited (ED) copper foil by weight provides far more accuracy than contact-thickness gauges. Since the topography of treated foil varies greatly, and since the density of copper is known, weighing a 1-by-1 foot sheet is the best way to determine the average thickness of a sheet of copper. So formally, the unit that we refer to as “ounces” is actually ounces per square foot.

Design with Calibre

Revolutionizing 3D IC design with integrated multiphysics verification

August 12, 2025

By Yoyo Li The semiconductor landscape is always evolving—sometimes quietly, sometimes at breakneck pace. Today, as integrated circuit designs progress...

By Design With Calibre

Semiconductor Packaging

The Missing Piece for Chiplet Success

August 11, 2025

Chiplets are revolutionizing the semiconductor industry, enabling unprecedented levels of integration, performance, and flexibility. By breaking complex designs into smaller,...

Semiconductor Packaging

How to Design Smarter: System-level multiphysics in 3D integration

August 07, 2025

What happens when a perfectly functioning chip fails to perform in a 3D IC package? As semiconductor designs stack multiple...

By John McMillan

Electronic Systems Design

Extending design left with PartQuest Design Enablement

August 06, 2025

Engineering begins before ECAD Traditional electronics design divides component research and tool-based design execution into separate stages. Engineers typically research...

Electronic Systems Design

What’s new in Z-planner Enterprise 2504

August 04, 2025

Z-planner Enterprise 2504 release The latest 2504 release of Z-planner Enterprise delivers powerful updates that streamline stackup planning, improve rigid-flex...

By Patrick Hope

Electronic Systems Design

How to have actionable DFM reviews: Unlocking digital manufacturing for SMBs with PCBflow and Xpedition Standard

With the release of Xpedition Standard, Siemens is delivering actionable DFM reviews that empower SMB teams to design with confidence.

By David Haboud

Electronic Systems Design

What’s new in Valor NPI 2504

The latest Valor NPI 2504 release delivers powerful enhancements that make your Design for Manufacturing (DFM) analysis faster, more intelligent,...

By Patrick Hope

Semiconductor Packaging

Ultimate guide to IC package types: choose the right package technology

Integrated circuits (ICs) are the foundation of modern electronics, powering everything from smartphones and medical devices to servers and automotive...

By John McMillan